Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

<p>A novel phenyl silicone resin with epoxy and acrylate group (PSREA) was successfully synthesized via the non-hydrolytic sol-gel condensation reaction of 3-glycidoxypropyltrimethoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane, and diphenylsilanediol, and was employed as the adhesion promoter for addition-cure silicone encapsulant (ASE) with high refractive index. The structure of PSREA was confirmed by Fourier transform infrared spectroscopy, ¹H nuclear magnetic resonance spectroscopy, and ²⁹Si nuclear magnetic resonance spectroscopy. The influence of PSREA on the properties of ASE was studied. It was found that PSREA could markedly enhance the adhesion strength of ASE to aluminum (Al) and poly(p-phenylene terephthamide) (PPA) substrate. When the content of PSREA was 1.5 phr, the shear strength of ASE was 4.43 and 2.27 MPa for Al and PPA substrate, which was about 71 and 266% higher than that of ASE without the adhesion promoter, respectively. In addition, PSREA had little effect on the mechanical properties, refractive index, and viscosity of ASE.</p