424 research outputs found

    InP DHBT Single-Stage and Multiplicative Distributed Amplifiers for Ultra-Wideband Amplification

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    This paper highlights the gain-bandwidth merit of the single stage distributed amplifier (SSDA) and its derivative multiplicative amplifier topologies (i.e. the cascaded SSDA (C-SSDA) and the matrix SSDA (M-SSDA)), for ultra-wideband amplification. Two new monolithic microwave integrated circuit (MMIC) amplifiers are presented: an SSDA MMIC with 7.1dB average gain and 200GHz bandwidth; and the world's first M-SSDA, which has a 12dB average gain and 170GHz bandwidth. Both amplifiers are based on an Indium Phosphide DHBT process with 250nm emitter width. To the authors best knowledge, the SSDA has the widest bandwidth for any single stage amplifier reported to date. Furthermore, the three tier M-SSDA has the highest bandwidth and gain-bandwidth product for any matrix amplifier reported to date

    Transimpedance amplifiers with 133 GHz bandwidth on 130 nm indium phosphide double heterojunction bipolar transistors

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    In this work, the authors present two transimpedance amplifier (TIA) circuits designed for fibre optical interconnect systems. They compare a common base (CB) topology with a common emitter (CE) shunt-shunt feedback topology in terms of frequency response, power consumption, noise, and input impedance. The two TIAs are designed on a 130 nm indium phosphide double heterojunction bipolar transistor technology from Teledyne Scientific Company (TSC) with an ft/fmax of 520 GHz/1.15 THz and are measured in the frequency and time domains. They exhibit a transimpedance gain of 42 dBΩ with a 133 GHz bandwidth, the highest bandwidth reported in the literature and power consumption of 32.3 mW for the CB and 25.5 mW for the CE. Eye diagram measurements were conducted up to 64 Gbps and input referred noise density was measured at 30.2 pA/√Hz for the CB and 13.9 pA/√Hz for the CE

    Compression of volume-surface integral equation matrices via Tucker decomposition for magnetic resonance applications

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    In this work, we propose a method for the compression of the coupling matrix in volume\hyp surface integral equation (VSIE) formulations. VSIE methods are used for electromagnetic analysis in magnetic resonance imaging (MRI) applications, for which the coupling matrix models the interactions between the coil and the body. We showed that these effects can be represented as independent interactions between remote elements in 3D tensor formats, and subsequently decomposed with the Tucker model. Our method can work in tandem with the adaptive cross approximation technique to provide fast solutions of VSIE problems. We demonstrated that our compression approaches can enable the use of VSIE matrices of prohibitive memory requirements, by allowing the effective use of modern graphical processing units (GPUs) to accelerate the arising matrix\hyp vector products. This is critical to enable numerical MRI simulations at clinical voxel resolutions in a feasible computation time. In this paper, we demonstrate that the VSIE matrix\hyp vector products needed to calculate the electromagnetic field produced by an MRI coil inside a numerical body model with 11 mm3^3 voxel resolution, could be performed in ∼33\sim 33 seconds in a GPU, after compressing the associated coupling matrix from ∼80\sim 80 TB to ∼43\sim 43 MB.Comment: 13 pages, 11 figure
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