3 research outputs found
Tunable Fiber Bragg Grating Ring Lasers using Macro Fiber Composite Actuators
The research reported herein includes the fabrication of a tunable optical fiber Bragg grating (FBG) fiber ring laser (FRL)1 from commercially available components as a high-speed alternative tunable laser source for NASA Langley s optical frequency domain reflectometer (OFDR) interrogator, which reads low reflectivity FBG sensors. A Macro-Fiber Composite (MFC) actuator invented at NASA Langley Research Center (LaRC) was selected to tune the laser. MFC actuators use a piezoelectric sheet cut into uniaxially aligned rectangular piezo-fibers surrounded by a polymer matrix and incorporate interdigitated electrodes to deliver electric fields along the length of the piezo-fibers. This configuration enables MFC actuators to produce displacements larger than the original uncut piezoelectric sheet. The FBG filter was sandwiched between two MFC actuators, and when strained, produced approximately 3.62 nm of wavelength shift in the FRL when biasing the MFC actuators from 500 V to 2000 V. This tunability range is comparable to that of other tunable lasers and is adequate for interrogating FBG sensors using OFDR technology. Three different FRL configurations were studied. Configuration A examined the importance of erbium-doped fiber length and output coupling. Configuration B demonstrated the importance of the FBG filter. Configuration C added an output coupler to increase the output power and to isolate the filter. Only configuration C was tuned because it offered the best optical power output of the three configurations. Use of Plastic Optical Fiber (POF) FBG s holds promise for enhanced tunability in future research
Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution
© 2004 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.DOI: 10.1109/TADVP.2004.831894As the data rate of integrated circuits dramatically
increases, interconnection speed at the backplane and board levels
are beginning to limit system performance, which drives investigations
into alternative interconnection technologies. Critical
factors to consider when evaluating alternative interconnection
approaches include interconnect speed, power consumption,
area, and compatibility with current backplane and board
integration technologies. Optical interconnections can achieve
very high speed with a significant reduction in interconnect
footprint compared to transmission lines, robust signal quality
in high-density interconnection systems because of immunity to
electromagnetic interference, and potentially simple to design
(compared to transmission lines) lines with materials which
can be postprocessed onto printed wiring boards or integrated
into the board structure. This paper explores design options for
planar optical interconnections integrated onto boards, discusses
fabrication options for both beam turning and embedded interconnections
to optoelectronic devices, describes integration
processes for creating embedded planar optical interconnections,
and discusses measurement results for a number of integration
schemes that have been demonstrated by the authors. In the area
of optical interconnections with beams coupled to and from the
board, the topics covered include integrated metal-coated polymer
mirrors and volume holographic gratings for optical beam turning
perpendicular to the board. Optical interconnections that utilize
active thin film (approximately 1-5 µm thick) optoelectronic
components embedded in the board are also discussed, using both
Si and high temperature FR-4 substrates. Both direct and evanescent
coupling of optical signals into and out of the waveguide are
discussed using embedded optical lasers and photodetectors