1,562 research outputs found

    Non pharmachological control of plasma cholesterol

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    paper di riferimento italiano, basato sui dati scientifici EBM - da capire e approfondire e ricordare e applicare nella pratica clinic

    What is eHealth?

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    Nuevos registros de Ceratopogonidae (Diptera) para Argentina y Chile

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    New records are provided for 22 species of biting midges (Diptera: Ceratopogonidae) from Argentina and Chile, 12 belonging to Forcipomyia Meigen, two to Atrichopogon Kieffer and Culicoides Latreille, and one to Leptoconops Skuse, Dasyhelea Kieffer, Paradasyhelea Macfie, Alluaudomyia Kieffer, Macrurohelea Ingram & Macfie and Palpomyia Meigen. Forcipomyia (F.) harpegonata Wirth & Soria, F. (F.) pictoni Macfie, F. (F.) sexvittata Wirth, F. (Lepidohelea) annulatipes Macfie, F. (L.) kuanoskeles Macfie, F. (Phytohelea) jocosa Saunders and F. (Thyridomyia) nana (Macfie) are firstly recorded from Argentina, and Leptoconops ricardoi Ronderos & Spinelli, Atrichopogon endemicus Spinelli & Marino, Culicoides chacoensis Spinelli & Wirth, Paradasyhelea brevipalpis (Ingram & Macfie) and Alluaudomyia schnacki Spinelli are firstly recorded from Chile. Forcipomyia calchaqui Spinelli & Marino is removed from the subgenus Thyridomyia Saunders and assigned to the subgenus Synthyridomyia Saunders.Se brindan nuevas citas de 22 especies de Ceratopogonidae para Argentina y Chile, de las cuales 12 pertenecen a Forcipomyia Meigen, dos a Atrichopogon Kieffer y Culicoides Latreille, y una a Leptoconops Skuse, Dasyhelea Kieffer, Paradasyhelea Macfie, Alluaudomyia Kieffer, Macrurohelea Ingram & Macfie y Palpomyia Meigen. Forcipomyia (F.) harpegonata Wirth & Soria, F. (F.) pictoni Macfie, F. (F.) sexvittata Wirth, F. (Lepidohelea) annulatipes Macfie, F. (L.) kuanoskeles Macfie, F. (Phytohelea) jocosa Saunders y F. (Thyridomyia) nana (Macfie) son registradas por primera vez para Argentina, mientras que Leptoconops ricardoi Ronderos & Spinelli, Atrichopogon endemicus Spinelli & Marino, Culicoides chacoensis Spinelli & Wirth, Paradasyhelea brevipalpis (Ingram & Macfie) y Alluaudomyia schnacki Spinelli lo son para Chile. Se excluye Forcipomyia calchaqui Spinelli & Marino del subgénero Thyridomyia Saunders y se la asigna a Synthyridomyia Saunders.Fil: Spinelli, Gustavo Ricardo. Universidad Nacional de La Plata. Facultad de Ciencias Naturales y Museo. División Entomología; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; ArgentinaFil: Marino, Pablo Ignacio. Universidad Nacional de La Plata. Facultad de Ciencias Naturales y Museo. División Entomología; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; ArgentinaFil: Gaddi, Ana Laura. Universidad Nacional de La Plata. Facultad de Ciencias Naturales y Museo. División Entomología; Argentin

    A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package

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    In this work, we present a fully parameterized capped transmission line model for electromagnetic optimization of a wafer level package (WLP) for RF MEMS applications using the Ansoft HFSS-TM electromagnetic simulator. All the degrees of freedom (DoF's) in the package fabrication can be modified within the model in order to optimize for losses and mismatch (capacitive and inductive couplings) introduced by the cap affecting the MEMS RF behaviour. Ansoft HFSS-TM was also validated for the simulation of capped RF MEMS devices by comparison against experimental data. A test run of capped 50 transmission lines and shorts was fabricated and tested.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

    Sindromi Metaboliche

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    Il volume contiene numerosi capitoli con dettagli tecnici sulle sindromi metaboliche (diagnosi, terapia, linee guida internazionali,diete, ecc) sia una riflessione di carattere metodologico sulla diagnostica clinica. Ogni capitolo ha un breve compendio in stile giornalistico-divulgativ

    Parasitic Effects Reduction for Wafer-Level Packaging of RF-Mems

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    In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The RF-MEMS package concept used is based on a wafer-level bonding of a capping silicon substrate to an RF-MEMS wafer. The capping silicon substrate resistivity, substrate thickness and the geometry of through-substrate electrical interconnect vias have been optimized using finite-element electromagnetic simulations (Ansoft HFSS). Test structures for electrical characterization have been designed and after their fabrication, measurement results will be compared with simulations.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

    Spiegazione, estratta dalla letteratura del termine eHealth

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    Introduction

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