Editorial for the Special Issue on Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II

Wide bandgap (WBG) semiconductors are becoming a key enabling technology for several strategic fields of human activities [...]

Effects of mole fraction variations and scaling on total variability in InGaAs MOSFETs

Variability is one of the major roadblocks for III-V semiconductors in nanoscale devices, according to the recent International Roadmap for Devices and Systems (IRDS). A particular concern is the detrimental effect of variability of threshold voltage due to channel compositional variations. In this paper, we investigate the impact of this variability source and the effects of scaling on the performance of Dual-Gate-Ultra-Thin-Body (DG-UTB) In0.53Ga0.47As MOSFETs. We model mole fraction variations in terms of the Indium content by taking into account the spatial inhomogeneity of the channel and the corresponding bandgap variations, analyzing the effects on threshold voltage variability. We thus define a variability source, i.e., Band Gap Fluctuation (BGF), and we compare the associated variability with the ones from other important sources, namely, Random Dopant Fluctuation (RDF), Work Function Fluctuation (WFF), Body- and Gate-Line Edge Roughness (B-LER and G-LER). We then define three corner cases for mole fraction variations to determine worst-case variability. Finally, the impact of scaling on variability is assessed by comparing results for two technology nodes on the linear and saturation threshold voltage, V-T,V-lin,V- V-T,V-sat, on-current, I-ON, leakage current, I-OFF, and linear and saturation sub-threshold slope, SS. We find that although scaling has no impact on BGF-induced V-T variability, it increases the total V-T, lin variability as well as that for I-ON and I-OFF

Insights into the off-state breakdown mechanisms in power GaN HEMTs

We analyze the off-state, three-terminal, lateral breakdown in AlGaN/GaN HEMTs for power switching applications by comparing two-dimensional numerical device simulations with experimental data from device structures with different gate-to-drain spacing and with either undoped or Carbon-doped GaN buffer layer. Our simulations reproduce the different breakdown-voltage dependence on the gate-drain-spacing exhibited by the two types of device and attribute the breakdown to: i) a combination of gate electron injection and source-drain punch-through in the undoped HEMTs; and ii) avalanche generation triggered by gate electron injection in the C-doped HEMTs

Electrical leakage phenomenon in heteroepitaxial cubic silicon carbide on silicon

© 2018 Author(s). Heteroepitaxial 3C-SiC films on silicon substrates are of technological interest as enablers to integrate the excellent electrical, electronic, mechanical, thermal, and epitaxial properties of bulk silicon carbide into well-established silicon technologies. One critical bottleneck of this integration is the establishment of a stable and reliable electronic junction at the heteroepitaxial interface of the n-type SiC with the silicon substrate. We have thus investigated in detail the electrical and transport properties of heteroepitaxial cubic silicon carbide films grown via different methods on low-doped and high-resistivity silicon substrates by using van der Pauw Hall and transfer length measurements as test vehicles. We have found that Si and C intermixing upon or after growth, particularly by the diffusion of carbon into the silicon matrix, creates extensive interstitial carbon traps and hampers the formation of a stable rectifying or insulating junction at the SiC/Si interface. Although a reliable p-n junction may not be realistic in the SiC/Si system, we can achieve, from a point of view of the electrical isolation of in-plane SiC structures, leakage suppression through the substrate by using a high-resistivity silicon substrate coupled with deep recess etching in between the SiC structures

Failure Physics and Reliability of GaN-Based HEMTs for Microwave and Millimeter-Wave Applications: A Review of Consolidated Data and Recent Results

Herein, the results are reviewed concerning reliability of high-electron mobility transistors (HEMTs) based on GaN, which currently represent the technology of choice for high-efficiency microwave and millimeter-wave power amplifiers. Several failure mechanisms of these devices are extensively studied, including converse piezoelectric effects, formation of conductive percolation paths at the edge of gate toward the drain, surface oxidation of GaN, time-dependent breakdown of GaN buffer, and of field-plate dielectric. For GaN HEMTs with scaled gate length, the simultaneous control of short-channel effects, deep-level dispersion, and hot-electron-induced degradation requires a careful optimization of epitaxial material quality and device design

Dynamic Behavior of Threshold Voltage and ID-VDS Kink in AlGaN/GaN HEMTs Due to Poole-Frenkel Effect

The kink effect in field-effect transistors (FETs) consists in a sudden increase in drain current, during a drain voltage sweep and leading to a higher drain current saturation value. We report new experimental data concerning the dynamic behavior of the "kink" in AlGaN/GaN HEMTs and correlate them with deep levels. The results demonstrate the role of the Poole-Frenkel effect in determining the occurrence of the kink and identify the experimental conditions that make it observable

PixFEL: development of an X-ray diffraction imager for future FEL applications

A readout chip for diffraction imaging applications at new generation X-ray FELs (Free Electron Lasers) has been designed in a 65 nm CMOS technology. It consists of a 32 × 32 matrix, with square pixels and a pixel pitch of 110 µm. Each cell includes a low-noise charge sensitive amplifier (CSA) with dynamic signal compression, covering an input dynamic range from 1 to 104 photons and featuring single photon resolution at small signals at energies from 1 to 10 keV. The CSA output is processed by a time-variant shaper performing gated integration and correlated double sampling. Each pixel includes also a small area, low power 10-bit time-interleaved Successive Approximation Register (SAR) ADC for in-pixel digitization of the amplitude measurement. The channel can be operated at rates up to 4.5 MHz, to be compliant with the rates foreseen for future X-ray FEL machines. The ASIC has been designed in order to be bump bonded to a slim/active edge pixel sensor, in order to build the first demonstrator for the PixFEL (advanced X-ray PIXel cameras at FELs) imager

Correlating electroluminescence characterization and physics-based models of InGaN/GaN LEDs: Pitfalls and open issues

Electroluminescence (EL) characterization of InGaN/GaN light-emitting diodes (LEDs), coupled with numerical device models of different sophistication, is routinely adopted not only to establish correlations between device efficiency and structural features, but also to make inferences about the loss mechanisms responsible for LED efficiency droop at high driving currents. The limits of this investigative approach are discussed here in a case study based on a comprehensive set of current- and temperature-dependent EL data from blue LEDs with low and high densities of threading dislocations (TDs). First, the effects limiting the applicability of simpler (closed-form and/or one-dimensional) classes of models are addressed, like lateral current crowding, vertical carrier distribution nonuniformity, and interband transition broadening. Then, the major sources of uncertainty affecting state-of-the-art numerical device simulation are reviewed and discussed, including (i) the approximations in the transport description through the multi-quantum-well active region, (ii) the alternative valence band parametrizations proposed to calculate the spontaneous emission rate, (iii) the difficulties in defining the Auger coefficients due to inadequacies in the microscopic quantum well description and the possible presence of extra, non-Auger high-current-density recombination mechanisms and/or Auger-induced leakage. In the case of the present LED structures, the application of three-dimensional numerical-simulation-based analysis to the EL data leads to an explanation of efficiency droop in terms of TD-related and Auger-like nonradiative losses, with a C coefficient in the 10−30 cm6/s range at room temperature, close to the larger theoretical calculations reported so far. However, a study of the combined effects of structural and model uncertainties suggests that the C values thus determined could be overestimated by about an order of magnitude. This preliminary attempt at uncertainty quantification confirms, beyond the present case, the need for an improved description of carrier transport and microscopic radiative and nonradiative recombination mechanisms in device-level LED numerical models

Modeling challenges for high-efficiency visible light-emitting diodes

In order to predict through numerical simulation the optical and carrier transport properties of GaN-based light-emitting diodes (LEDs), a genuine quantum approach should be combined with an atomistic description of the electronic structure. However, computational considerations have elicited the empirical inclusion of quantum contributions within conventional semiclassical drift-diffusion approaches. The lack of first-principles validation tools has left these \u201cquantum corrections\u201d largely untested, at least in the context of LED simulation. We discuss here the results obtained comparing state-of-the-art commercial numerical simulators, in order to assess the predictive capabilities of some of the most important quantum-based models complementing the drift-diffusion equations