Defects production and annealing in self-implanted Si

230-keV 28Si ions were implantated into Si(100) at room temperature with doses from 1014 to 1015/cm2. The samples were analyzed by x-ray double crystal diffractometry and 2-MeV 4He ion channeling spectrometry. The implanted layer has a parallel lattice spacing equal to that of the unimplanted substrate. The perpendicular lattice spacing is larger than that of the unimplanted substrate and is proportional to the defect concentration extracted from the channeling measurement. Both the perpendicular lattice spacing and the defect concentration increase nonlinearly with ion dose. The defect concentration initially increases slowly with dose until a critical value (~15%, at 4×1014/cm2), then rises rapidly, and finally a continuous amorphous layer forms. The initial sluggish increase of the damage is due to the considerable recombination of point defects at room temperature. The rapid growth of the defect concentration is attributed to the reduction of the threshold energy for atomic displacement in a predamaged crystal. The amorphization is envisioned as a cooperative process initiated by a spontaneous collapse of heavily damaged crystalline regions. The annealing behavior of the damaged layer reveals various stages of defect recovery, indicating that the damage consists of a hierarchy of various defect structures of vacancy and interstitial aggregates

Generation and recovery of strain in (28)Si-implanted pseudomorphic GeSi films on Si(100)

Effects of ion implantation of 320 keV Si-28 at room temperature in pseudomorphic metastable GexSi1-x (x almost-equal-to 0.04, 0.09, 0.13) layers approximately 170 nm thick grown on Si(100) wafers were characterized by x-ray double-crystal diffractometry and MeV He-4 channeling spectrometry. The damage induced by implantation produces additional compressive strain in the GexSi1-x layers, superimposed on the intrinsic compressive strain of the heterostructures. This strain rises with the dose proportionally for doses below several times 10(14) Si-28/cm2. Furthermore, for a given dose, the strain increases with the Ge content in the layer. Upon thermal processing, the damage anneals out and the strain recovers to the value before implantation. Amorphized samples (doses of greater than 2 x 10(15) Si-28/cm2) regrow poorly

Defect production in Si(100) by 19F, 28Si, 40Ar, and 131Xe implantation at room temperature

We used x-ray double-crystal diffractometry and MeV 4He channeling spectrometry to study quantitatively the damage produced in Si(100) at room temperature by 230-keV 19F, 230-keV 28Si, 250-keV 40Ar, or 570-keV 131Xe implantation. The measured defect concentration and the perpendicular strain have the same depth profile, and both are depleted near the surface compared to the Frenkel pair concentration calculated from computer simulation. The perpendicular strain is proportional to the defect concentration with a coefficient of B~0.01 common to all implanted species. The maximum value of the perpendicular strain and of the defect concentration rises nonlinearly with the dose for all species. The damage produced by different implanted species depends on the dose in approximately the same way save for a scaling factor of the dose. In the regime of low damage, the strain and the defect concentration rise linearly with increasing dose. The slope of this rise with dose increases with the square of the Frenkel pairs produced per unit dose of incident ions, as calculated from computer simulations. This fact means that stable defects produced by room-temperature implantation in Si(100) cannot be predicted by a linear cascade model

Damage production and annealing in 28Si-implanted CoSi2/Sim(111) heterostructures

The damage in epitaxial CoSi2 films 500 nm thick grown on Si(111) produced by room-temperature implantation of 150 keV 28Si were investigated by 2-MeV 4He channeling spectrometry, double-crystal x-ray diffractometry, and electrical resistivity measurements. The damage in the films can be categorized into two types. In lightly (heavily) damaged CoSi2 the damage is in the form of point-like (extended) defects. The resistivity of lightly damaged CoSi2 films rises with the dose of implantation. Electrical defects correlate well with structural ones in lightly damaged films. The resistivity of heavily damaged films flattens off while the structural defects continue to rise with the dose, so that resistivity no longer correlates with structural defects. Upon thermal annealing, lightly damaged films can fully recover structurally and electrically, whereas heavily damaged films do so only electrically. A residual structural damage remains even after annealing at 800 °C for 60 min

Compensating impurity effect on epitaxial regrowth rate of amorphized Si

The epitaxial regrowth of ion-implanted amorphous layers on Si with partly compensated doping profiles of 11B, 75As, and 31P was studied. Single implants of these impurities are found to increase the regrowth rate at 475 and 500°C. The compensated layers with equal concentrations of 11B and 31P or 11B and 75As show a strong decrease of the regrowth whereas for the layers with overlapping 75As and 31P profiles no compensation has been found

Reflection high-energy electron diffraction patterns of CrSi_2 films on (111) silicon

Highly oriented films of the semiconducting transition metal silicide, CrSi2, were grown on (111) silicon substrates, with the matching crystallographic faces being CrSi_2(001)/Si(111). Reflection high‐energy electron diffraction (RHEED) yielded symmetric patterns of sharp streaks. The expected streak spacings for different incident RHEED beam directions were calculated from the reciprocal net of the CrSi_2(001) face and shown to match the observed spacings. The predominant azimuthal orientation of the films was thus determined to be CrSi_2〈210〉∥Si〈110〉. This highly desirable heteroepitaxial relationship may be described with a common unit mesh of 51 Å^2 and a mismatch of −0.3%. RHEED also revealed the presence of limited film regions of a competing azimuthal orientation, CrSi_2〈110〉∥Si〈110〉. A new common unit mesh for this competing orientation is suggested; it possesses an area of 612 Å^2 and a mismatch of −1.2%

Absorption in quantum electrodynamics cavities in terms of a quantum jump operator

We describe the absorption by the walls of a quantum electrodynamics cavity as a process during which the elementary excitations (photons) of an internal mode of the cavity exit by tunneling through the cavity walls. We estimate by classical methods the survival time of a photon inside the cavity and the quality factor of its mirrors

Ion implantation and low-temperature epitaxial regrowth of GaAs

Channeling and transmission electron microscopy have been used to investigate the parameters that govern the extent of damage in ion‐implanted GaAs and the crystal quality following capless furnace annealing at low temperature (∼400 °C). The implantation‐induced disorder showed a strong dependence on the implanted ion mass and on the substrate temperature during implantation. When the implantation produced a fully amorphous surface layer the main parameter governing the regrowth was the amorphous thickness. Formation of microtwins after annealing was observed when the initial amorphous layer was thicker than 400 Å. Also, the number of extended residual defects after annealing increased linearly with the initial amorphous thickness and extrapolation of that curve predicts good regrowth of very thin (<400 Å) GaAs amorphous layers produced by ion implantation. A model is presented to explain the observed features of the low‐temperature annealing of GaAs

Depth dependence of atomic mixing by ion beams

Ion backscattering spectrometry has been used to investigate the depth dependence of atomic mixing induced by ion beams. Samples consisting of a thin Pt (or Si) marker a few tens of angstroms thick buried at different depths in a deposited Si (or Pt) layer were bombarded with Xe+ of 300 keV at 2×10^16 cm^–2 dose and Ar+ of 150 keV at 5×10^15cm^–2 dose. Significant spreading of the marker was observed as a result of ion irradiation. The amount of spreading was measured as a function of depth of the marker, which was then compared with the deposited energy distribution. Measurements of this kind promise new insight into the nature of the interaction between ion beams and solids

Sequential nature of damage annealing and activation in implanted GaAs

Rapid thermal processing of implanted GaAs reveals a definitive sequence in the damage annealing and the electrical activation of ions. Removal of implantation-induced damage and restoration of GaAs crystallinity occurs first. Irrespective of implanted species, at this stage the GaAs is n-type and highly resistive with almost ideal values of electron mobility. Electrical activation is achieved next when, in a narrow anneal temperature window, the material becomes n- or p-type, or remains semi-insulating, commensurate to the chemical nature of the implanted ion. Such a two-step sequence in the electrical doping of GaAs by ion implantation may be unique of GaAs and other compound semiconductors