Publication venue IEE-INST ELEC ENG
Publication date 01/01/2005
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
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Publication venue 'AIP Publishing'
Publication date 01/01/2016
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
Publication date 01/01/2011
Field of study Get PDF The heterogeneous integration of III-V semiconductor lasers on a silicon waveguide platform using DVS-BCB adhesive bonding is reviewed. Both mW-level lasers and ultra-compact laser sources are discussed
Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
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Publication venue 'Institute of Electrical and Electronics Engineers (IEEE)'
Publication date 01/01/2006
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