4 research outputs found
Reactive additive capillary stamping with double network hydrogel-derived aerogel stamps under solvothermal conditions
Integration of solvothermal reaction products into complex thin-layer
architectures is frequently achieved by combinations of layer transfer and
subtractive lithography, whereas direct additive substrate patterning with
solvothermal reaction products has remained challenging. We report reactive
additive capillary stamping under solvothermal conditions as a parallel
contact-lithographic access to patterns of solvothermal reaction products in
thin-layer configurations. To this end, corresponding precursor inks are
infiltrated into mechanically robust mesoporous aerogel stamps derived from
double-network hydrogels (DNHGs). The stamp is then brought into contact with a
substrate to be patterned under solvothermal reaction conditions inside an
autoclave. The precursor ink forms liquid bridges between the topographic
surface pattern of the stamp and the substrate. Evaporation-driven enrichment
of the precursors in these liquid bridges along with their liquid-bridge-guided
conversion into the solvothermal reaction products yields large-area submicron
patterns of the solvothermal reaction products replicating the stamp
topography. As example, we prepared thin hybrid films, which contained ordered
monolayers of superparamagnetic submicron nickel ferrite dots prepared by
solvothermal capillary stamping surrounded by nickel electrodeposited in a
second, orthogonal substrate functionalization step. The submicron nickel
ferrite dots acted as magnetic hardener halving the remanence of the
ferromagnetic nickel layer. In this way, thin-layer electromechanical systems,
transformers and positioning systems may be customized
3-Methylideneoxolane-2,5-dione
The title compound (itaconic anhydride), C5H4O3, consists of a five-membered carbon–oxygen ring in a flat envelope conformation (the unsubstituted C atom being the flap) with three exocyclic double bonds to two O atoms and one C atom. In contrast to the bond lengths, which are very similar to those in itaconic acid in its pure form or in adducts with other molecules, the bond angles differ significantly because of the effect of ring closure giving rise to strong distortions at the C atoms involved in the exocyclic double bonds. In the crystal, C—H...O interactions link the molecules, forming an extended three-dimensional network
Reactive Additive Capillary Stamping with Double Network Hydrogel-Derived Aerogel Stamps under Solvothermal Conditions
Integration of solvothermal reaction products into complex
thin-layer
architectures is frequently achieved by combinations of layer transfer
and subtractive lithography, whereas direct additive substrate patterning
with solvothermal reaction products has remained challenging. We report
reactive additive capillary stamping under solvothermal conditions
as a parallel contact-lithographic access to patterns of solvothermal
reaction products in thin-layer configurations. To this end, corresponding
precursor inks are infiltrated into mechanically robust mesoporous
aerogel stamps derived from double-network hydrogels. The stamp is
then brought into contact with a substrate to be patterned under solvothermal
reaction conditions inside an autoclave. The precursor ink forms liquid
bridges between the topographic surface pattern of the stamp and the
substrate. Evaporation-driven enrichment of the precursors in these
liquid bridges, along with their liquid-bridge-guided conversion into
the solvothermal reaction products, yields large-area submicron patterns
of the solvothermal reaction products replicating the stamp topography.
For example, we prepared thin hybrid films, which contained ordered
monolayers of superparamagnetic submicron nickel ferrite dots prepared
by solvothermal capillary stamping surrounded by nickel electrodeposited
in a second orthogonal substrate functionalization step. The submicron
nickel ferrite dots acted as a magnetic hardener, halving the remanence
of the ferromagnetic nickel layer. In this way, thin-layer electromechanical
systems, transformers, and positioning systems may be customized