Influence of a back side dielectric mirror on thin film silicon solar cells performance

International audienc

Electrical Properties of Monocrystalline Thin Film Si for Solar Cells Fabricated By Rapid Vapor Deposition with Nano-Surface Controlling Double Layer Porous Si in H2

International audienceIntroduction To reduce the Si thickness with maintaining the high quality is a promising approach to reduce the cost of monocrystalline Si solar cell. A major method to fabricate monocrystalline thin Si is epitaxy by Chemical Vapor Deposition (CVD) and Layer Transfer Process (LTP) as shown in Fig. 1. A seed layer and a sacrificial layer such as double layer porous Si (DLPS) which consist of a Low Porous Layer (LPL) and a High Porous Layer (HPL) are fabricated on the surface of a monocrystalline Si wafer, and then Si is epitaxially deposited on the seed layer. This wafer can then be reused in LTP, thus further reducing the material cost of these Si cells. There remain two challenging issues: (ⅰ) crystal defect introduced during epitaxy caused by the roughness of the seed layer 1) and (ⅱ) low deposition rate and yield of epitaxy by CVD. To solve problem (ⅰ), we proposed a Zone Heating Recrystallization (ZHR) method 2) to smoothen the DLPS surface as shown in Fig.2. The structure of the DLPS surface can be modified by using an upper lamp heater to scan the surface in one direction and a bottom heater to pre-heat Si substrate. To solve problem (ⅱ), we proposed a Rapid Vapor Deposition (RVD) method 3) as shown in Fig.3. By depositing Si under a high vapor pressure by heating the source Si to over 2000℃, the deposition rate of over 10 μm/min with a higher yield is achieved. By applying both the ZHR and RVD methods, we successfully reduced the roughness of a DLPS surface and obtained monocrystalline Si with Si wafer level. The critical effect of lowering the roughness of a DLPS surface to R ms < 0.3 nm wa

Fabrication of Si tunnel diodes for c-Si based tandem solar cells using proximity rapid thermal diffusion

Increasing competitiveness of photovoltaic (PV) devices is currently an important objective in technological research, especially with the development of tandem solar cells based on c-Si as the bottom cell. For a monolithical structure, a tunnel diode in between the top and bottom cells is necessary. In this work we report on the development of the fabrication of Si tunnel junction using a combination of spin-on doping and proximity rapid thermal diffusion. A desirable attribute of this process is simplicity. Two different structures p++/n++ or n++/p++ were fabricated on (100) Si substrates. Carrier density profiles were measured by ECV to characterize the shallow doping profiles. Vertical tunnel diodes were fabricated and I(V) characteristics are presented. It is shown that device peak current densities up to 270 A/cm² are achieved using this technique, which is the best value reported with such simple technique

Design and fabrication of photonic crystal thin film photovoltaic cells

International audienceWe present the integration of an absorbing planar photonic crystal within a thin film photovoltaic cell. The devices are based on a stack including a hydrogenated amorphous silicon P-i-N junction surrounded by TCO layers, with a back metallic contact. Optical simulations exhibit a significant increase of the integrated absorption in the 300-720nm wavelength range. The global electro-optical characteristics of such a new solar cell, and the impact of surface passivation, are also discussed. Carrier generation rate maps calculated by optical simulations are introduced as input data in a commercial electrical simulation software. The fabrication of such a device is finally addressed, with a specific focus on the use of low cost nanopatterning processes compatible with large areas

The Electrical Challenges of a Patterned TCO for HIT Solar Cell

december 12-16, 2014International audienceno abstrac

Influence of patterning the TCO layer on the series resistance of thin film HIT solar cells

Thin HIT solar cells combine efficient surface passivation and high open circuit voltage leading to high conversion efficiencies. They require a TCO layer in order to ease carriers transfer to the top surface fingers. This Transparent Conductive Oxide layer induces parasitic absorption in the low wavelength range of the solar spectrum that limits the maximum short circuit current. In case of thin film HIT solar cells, the front surface is patterned in order to increase the effective life time of photons in the active material, and the TCO layer is often deposited with a conformal way leading to additional material on the sidewalls of the patterns. In this article, we propose an alternative scheme with a local etching of both the TCO and the front a-Si:H layers in order to reduce the parasitic absorption. We study how the local resistivity of the TCO evolves as a function of the patterns, and demonstrate how the increase of the series resistance can be compensated in order to increase the conversion efficiency

Influence of patterning the TCO layer on the series resistance of thin film HIT solar cells

Thin HIT solar cells combine efficient surface passivation and high open circuit voltage leading to high conversion efficiencies. They require a TCO layer in order to ease carriers transfer to the top surface fingers. This Transparent Conductive Oxide layer induces parasitic absorption in the low wavelength range of the solar spectrum that limits the maximum short circuit current. In case of thin film HIT solar cells, the front surface is patterned in order to increase the effective life time of photons in the active material, and the TCO layer is often deposited with a conformal way leading to additional material on the sidewalls of the patterns. In this article, we propose an alternative scheme with a local etching of both the TCO and the front a-Si:H layers in order to reduce the parasitic absorption. We study how the local resistivity of the TCO evolves as a function of the patterns, and demonstrate how the increase of the series resistance can be compensated in order to increase the conversion efficiency

Facile metallization of dielectric coatings for plasmonic solar cells

International audienc