Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials – A review

[Abstract]: The internet of things and growing demand for smaller and more advanced devices has created the problem of high heat production in electronic equipment, which greatly reduces the work performance and life of the electronic instruments. Thermal interface material (TIM) is placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. The development of suitable TIM with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general, their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent developments in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve throughplane thermal conductivity (TPTC) (k⊥). For a better understanding of TC, a comprehensive background is presented. Several methods to improve the effective (out-plane) thermal conductivity of polymer composites and different theoretical models for the calculation of TC are also discussed. In the end, it is given a detailed conclusion that provides drawbacks of some fillers, multiple significant routes recommended by other researchers to build thermally conductive polymer composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer-based thermal interface material.This research was funded by Ministry of Science and Technology of the People’s Republic of China, “Light Shipbuilding Fire- Resistant Sandwich Panels with Improved Balance of Acoustic Insulation, Mechanical and Environmentally-Friendly Properties”, grant number 2019YFE0124000.China. Ministry of Science and Technolog

Measuring Organizational Commitment and Occupational Stress of Pakistani Doctors: Comparing Lahore and Karachi Public Hospitals in Gender Perspective

The purpose of the study is to investigate the disparity in cause and consequences of stress among male and female genders in private hospitals. The self-constructed stress model is used to evaluate the pertinent effect of stressors on organizational commitment. 219 respondents took part in the study from which 114 participants were from Lahore and 105 from Karachi through convince sampling technique. Semi-constructed survey based online matrix is used to achieve quantitative aspect. According to results evaluated causes of stress among male and female varies. In addition, females are under less stress than males at operational level. Moreover, due to social support programmes, employees working in Lahore hospitals are under less stress in comparison to Karachi hospitals. As indicated in the results interpreted, causes of stress varies among 2 contrasting gender. Females are under more stress due to personal factor whereas in male organizational and environmental factor is a chief cause for stress. Organizational commitment for females is affected by family problems and personality clashes while in males it is Job demand, leadership, and economic uncertainty that is affecting organizational commitment. In male and female workforce, consequence of stress doesn’t vary. Nevertheless, to overcome stress, females utilize personal resources in a very effective fashion and display behavioral symptoms while men displays cognitive behavior. Normative commitment is more prevalent among males as compare to opposing gender whereas in females affective commitment and continuance commitment is high. In addition, Lahore workforces are under low stress than the Karachi workforce

Measuring Organizational Commitment and Occupational Stress of Pakistani Doctors: Comparing Lahore and Karachi Public Hospitals in Gender Perspective

The purpose of the study is to investigate the disparity in cause and consequences of stress among male and female genders in private hospitals. The self-constructed stress model is used to evaluate the pertinent effect of stressors on organizational commitment. 219 respondents took part in the study from which 114 participants were from Lahore and 105 from Karachi through convince sampling technique. Semi-constructed survey based online matrix is used to achieve quantitative aspect. According to results evaluated causes of stress among male and female varies. In addition, females are under less stress than males at operational level. Moreover, due to social support programmes, employees working in Lahore hospitals are under less stress in comparison to Karachi hospitals. As indicated in the results interpreted, causes of stress varies among 2 contrasting gender. Females are under more stress due to personal factor whereas in male organizational and environmental factor is a chief cause for stress. Organizational commitment for females is affected by family problems and personality clashes while in males it is Job demand, leadership, and economic uncertainty that is affecting organizational commitment. In male and female workforce, consequence of stress doesn’t vary. Nevertheless, to overcome stress, females utilize personal resources in a very effective fashion and display behavioral symptoms while men displays cognitive behavior. Normative commitment is more prevalent among males as compare to opposing gender whereas in females affective commitment and continuance commitment is high. In addition, Lahore workforces are under low stress than the Karachi workforce

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials – A review

The internet of things and growing demand for smaller and more advanced devices has created the problem of high heat production in electronic equipment, which greatly reduces the work performance and life of the electronic instruments. Thermal interface material (TIM) is placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. The development of suitable TIM with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general, their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent developments in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (k⊥). For a better understanding of TC, a comprehensive background is presented. Several methods to improve the effective (out-plane) thermal conductivity of polymer composites and different theoretical models for the calculation of TC are also discussed. In the end, it is given a detailed conclusion that provides drawbacks of some fillers, multiple significant routes recommended by other researchers to build thermally conductive polymer composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer-based thermal interface material