Constructing vector-valued Siegel modular forms from scalar-valued Siegel modular forms

This paper gives a simple method for constructing vector-valued Siegel modular forms from scalar-valued ones. The method is efficient in producing the siblings of Delta, the smallest weight cusp forms that appear in low degrees. It also shows the strong relations between these modular forms of different genera. We illustrate this by a number of examples.Comment: 21 pages; misprints corrected; to appear in PAM

Siegel modular forms of genus 2 and level 2

We study vector-valued Siegel modular forms of genus 2 and level 2. We describe the structure of certain modules of vector-valued modular forms over rings of scalar-valued modular forms.Comment: 46 pages. To appear in International Journal of Mathematic

Covariants of binary sextics and vector-valued Siegel modular forms of genus two

We extend Igusa's description of the relation between invariants of binary sextics and Siegel modular forms of degree two to a relation between covariants and vector-valued Siegel modular forms of degree two. We show how this relation can be used to effectively calculate the Fourier expansions of Siegel modular forms of degree two.Comment: 19 page

Modeling the Temperature Bias of Power Consumption for Nanometer-Scale CPUs in Application Processors

We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into account many of the physical effects that occur within such systems. Together with two algorithms described in the paper, our results can be used, for instance by engineers designing power or thermal management units, to cancel the temperature-induced bias on power measurements. This will help them gather temperature-neutral power data while running multiple instance of their benchmarks. Also power requirements and system failure rates can be decreased by controlling the CPU's thermal behavior. Even though it is usually assumed that the temperature/power relationship is exponentially related, there is however a lack of publicly available physical temperature/power measurements to back up this assumption, something our paper corrects. Via measurements on two pertinent platforms sporting nanometer-scale application processors, we show that the power/temperature relationship is indeed very likely exponential over a 20{\deg}C to 85{\deg}C temperature range. Our data suggest that, for application processors operating between 20{\deg}C and 50{\deg}C, a quadratic model is still accurate and a linear approximation is acceptable.Comment: Submitted to SAMOS 2014; International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV

Covariants of binary sextics and modular forms of degree 2 with character

We use covariants of binary sextics to describe the structure of modules of scalar-valued or vector-valued Siegel modular forms of degree 2 with character, over the ring of scalar-valued Siegel modular forms of even weight. For a modular form defined by a covariant we express the order of vanishing along the locus of products of elliptic curves in terms of the covariant.Comment: 18 page