201 research outputs found
Recommended from our members
Computational continuum modeling of solder interconnects: Applications
The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Fb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder, which is currently under development, was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a mini ball grid array solder interconnect. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the thermomechanical response of a mini ball grid array solder interconnects then will be presented
Recommended from our members
Life prediction modeling of solder interconnects for electronic systems
A microstructurally-based computational simulation is presented that predicts the behavior and lifetime of solder interconnects for electronic applications. This finite element simulation is based on an internal state variable constitutive model that captures both creep and plasticity, and accounts for microstructural evolution. The basis of the microstructural evolution is a simple model that captures the grain size and microstructural defects in the solder. The mechanical behavior of the solder is incorporated into the model in the form of time-dependent viscoplastic equations derived from experimental creep tests. The unique aspect of this methodology is that the constants in the constitutive relations of the model are determined from experimental tests. This paper presents the constitutive relations and the experimental means by which the constants in the equations are determined. The fatigue lifetime of the solder interconnects is predicted using a damage parameter (or grain size) that is an output of the computer simulation. This damage parameter methodology is discussed and experimentally validated
Recommended from our members
Computational continuum modeling of solder interconnects
The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183 C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder which is currently in development was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of various leadless chip carrier solder interconnects to determine the effects of variations in geometry and loading. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the effect of geometry and loading variations on leadless chip carrier solder interconnects then will be presented
Recommended from our members
Microstructurally based finite element simulation of solder joint behavior
The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue) the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A finite element simulation methodology to predict solder joint mechanical behavior, that includes microstructural evolution, has been developed. The mechanical constitutive behavior was incorporated into the time dependent internal state variable viscoplastic model through experimental creep tests. The microstructural evolution is incorporated through a series of mathematical relations that describe mass flow in a temperature/strain environment. The model has been found to simulate observed thermomechanical fatigue behavior in solder joints
Recommended from our members
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue
Politische Dimensionen von Militärübungen und Manövern – ein Projektbericht
Die virtuellen Kriege und Operationen, die in Militärübungen gespielt und geprobt werden, können entweder der Abschreckung dienen oder aber Angriffe vorbereiten bzw. zur Maskierung tatsächlicher Angriffe dienen. Für Beobachter ist es vielfach nicht offensichtlich, um welche Art von Militärübung es sich handelt. Die Ergebnisse eines vierjährigen internationalen Projektes zu politischen Dimensionen von Militärübungen richten das Schlaglicht insbesondere auf Missverständnisse und deren ungewollte politische Auswirkungen, die im Extremfall unbeabsichtigt zum Krieg führen können
Environmental and physiological factors that affect the efficacy of herbicides that inhibit the enzyme protoporphyrinogen oxidase: a literature review
- …