Qualification and Integration Aspects of the DSSC Mega-Pixel X-Ray Imager

The focal-plane module is the key component of the DEPFET sensor with signal compression (DSSC) mega-pixel X-ray imager and handles the data of 128 ×512 pixels. We report on assembly-related aspects, discuss the experimental investigation of bonding behavior of different adhesives, and present the metrology and electrical test results of the production. The module consists of two silicon (Si) sensors with flip-chip connected CMOS integrated circuits, a Si-heat spreader, a low-temperature co-fired ceramics circuit board, and a molybdenum frame. A low-modulus urethane-film adhesive fills the gaps between on-board components and frame. It is also used between board and heat spreader, reduces the misfit strain, and minimizes the module warpage very efficiently. The heat spreader reduces the on-board temperature gradient by about one order of magnitude. The placement precision of the bare modules to each other and the frame is characterized by a standard deviation below 10 and 65 μ m, respectively. The displacement due to the in-plane rotation and vertical tilting errors remains below 80 and 50 μm, respectively. The deflection of the sensor plane shows a mean value below 30 μm with a standard deviation below 15 μm. Less than 4% of the application-specified integrated circuits (ASICs) exhibit a malfunction. More than two-thirds of the sensors have a maximum leakage current below 1 μA

Mechanical and acoustic emission characterization of deformation and fracture mechanisms in metal matrix composites Final report

Binary AlFe powder alloys were alloyed with Ce, V, and Si and reinforced with SiC particles of 4 to 16 #mu#m and volume fractions of 3 to 30%. Effects of reinforcement particle size and volume fraction on mechanical properties, deformation and fracture behavior were investigated as part of a cooperative work carried out for the last two years by the German Aerospace Research Establishment and the Hebrew University. The investigation employed microscopical, mechanical and acoustic emission (AE) characterization techniques for the interrogation of matrix alloys and composites. For all alloys, mechanical properties as evaluated in this program depend on the volume fraction of SiC particles. Composites with a matrix containing 6 wt.% Fe and more also show a dependence on particle size, that may vary with temperature. The results obtained on deformation and fracture offer the possibility to optimize these particle reinforced composites for elevated temperatures regarding processing and application by choosing the optimum particle size and volume fraction. (orig.)SIGLEAvailable from TIB Hannover: DtF QN1(39,51) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman