Heat tolerance of titanium boride and titanium nitride contacts to gallium arsenide

For contacts prepared from titanium borides by and nitrides ion-plasma sputtering onto gallium arsenide both formation mechanisms and thermal stability were investigated. We used a combination of structural, secondary-emission, optical and electrophysical methods, such as electronography, X-ray diffraction, atomic force microscopy, Auger electron spectroscopy, secondary-ion mass spectrometry, taking photoluminescence spectra and I - V curves. A physical model for contact formation was proposed. According to it, BxGa₁₋xAs (GaNxAs₁₋x) solid solutions are formed at the phase interfaces when titanium borides (nitrides) are deposited. The defects are produced in the semiconductor near-surface regions during heterostructure formation and further heat treatment. The correlation between the physico-chemical interactions at contact interfaces and the contact electrophysical parameters occurs through these defects. The objects of our investigation demonstrated high thermal stability. This was due to their two-layer structure formed by components having well-pronounced antidiffusion properties. As a result, the interdiffusion processes at the phase interfaces are drastically weakened

Effect of rapid thermal annealing on properties of contacts Au-Mo-TiBx-GaAs

The analytical, structural and electrophysical techniques have been applied to studies of the thermal degradation mechanism appearing in diode structures with the Schottky barrier Au-Mo-TiBxGaAs. It was shown that the rapid thermal annealing at T = 600 °C during 60 sec in hydrogen atmosphere results in creating the ELS type center in the space charge region of GaAs. This center is represented by the complex VGa+VAs, which has been confirmed by photoluminescence measurements. It causes the appearance of excess current at the initial part of current-voltage characteristic