Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects

This paper reports an approach for co-fabrication of silicon-on-insulator (SOI) sensors with low-resistance vertical electrical interconnects in thick (up to 600μm ) wafers. The thru-wafer interconnects double-sided (TWIDS) process is based on bottom-up seedless copper electroplating, and allows for voids-free features and high aspect ratio (wafer thickness to copper diameter ratio of 10:1). This work describes the design trade-offs, process flow, and characterization of interconnects. TWIDS technology is compatible with a standard SOI micro-electro-mechanical systems (MEMS) fabrication process and is applicable for micro sensors, such as accelerometers, gyroscopes, resonators, and RF MEMS devices, as well as for the 3-D MEMS assemblies. As a demonstration of potential applications, miniature toroidal ring gyroscopes were fabricated using the TWIDS process. The experimental characterization showed that the low-resistance interconnects with low parasitic losses are suitable for integration with capacitive-detection sensors. In addition, the mechanical stability of the interconnects is discussed in this paper, and a method to enhance structural rigidity by means of filling the insulating gaps with Parylene C is demonstrated. [2017-0179

Origami-Like 3-D Folded MEMS Approach for Miniature Inertial Measurement Unit

This paper presents a miniature 50 mm3 inertial measurement unit (IMU) implemented using a folded microelectromechanical systems (MEMS) process. The approach is based on wafer-level fabrication of high aspect-ratio single-axis sensors interconnected by flexible hinges and folded into a 3-D configuration, like a silicon Origami [1]. Two different materials for flexible hinges have been explored, including photo-definable polyimide and parylene-C. We report, for the first time, an IMU prototype with seven operational sensors: three accelerometers, three gyroscopes, and a prototype of a reference clock. This paper concludes with the results of experimental characterization of inertial sensors demonstrating the feasibility of the proposed approach for a compact IMU

Double-Sided Process for MEMS SOI Sensors with Deep Vertical Thru-Wafer Interconnects

This paper reports an approach for co-fabrication of silicon-on-insulator (SOI) sensors with low-resistance vertical electrical interconnects in thick (up to 600μm ) wafers. The thru-wafer interconnects double-sided (TWIDS) process is based on bottom-up seedless copper electroplating, and allows for voids-free features and high aspect ratio (wafer thickness to copper diameter ratio of 10:1). This work describes the design trade-offs, process flow, and characterization of interconnects. TWIDS technology is compatible with a standard SOI micro-electro-mechanical systems (MEMS) fabrication process and is applicable for micro sensors, such as accelerometers, gyroscopes, resonators, and RF MEMS devices, as well as for the 3-D MEMS assemblies. As a demonstration of potential applications, miniature toroidal ring gyroscopes were fabricated using the TWIDS process. The experimental characterization showed that the low-resistance interconnects with low parasitic losses are suitable for integration with capacitive-detection sensors. In addition, the mechanical stability of the interconnects is discussed in this paper, and a method to enhance structural rigidity by means of filling the insulating gaps with Parylene C is demonstrated. [2017-0179

Origami-Like 3-D Folded MEMS Approach for Miniature Inertial Measurement Unit

This paper presents a miniature 50 mm3 inertial measurement unit (IMU) implemented using a folded microelectromechanical systems (MEMS) process. The approach is based on wafer-level fabrication of high aspect-ratio single-axis sensors interconnected by flexible hinges and folded into a 3-D configuration, like a silicon Origami [1]. Two different materials for flexible hinges have been explored, including photo-definable polyimide and parylene-C. We report, for the first time, an IMU prototype with seven operational sensors: three accelerometers, three gyroscopes, and a prototype of a reference clock. This paper concludes with the results of experimental characterization of inertial sensors demonstrating the feasibility of the proposed approach for a compact IMU

Electrostatic compensation of structural imperfections in dynamically amplified dual-mass gyroscope

This paper presents a study on dynamics of a dual-mass MEMS vibratory gyroscope in presence of fabrication imperfections and reports a method for precision electrostatic frequency tuning of the operational modes. A number of multi-mass MEMS gyroscopes have emerged in recent years pursuing different goals, such as dynamically balanced structure, increased bandwidth, and dynamic amplification. Along with many perceived advantages of multi-mass devices, several challenges associated with mode-matching in a system with increased number of degrees-of-freedom (DOF) have to be considered. This work shows that it is possible to apply the DC tuning techniques, similar to tuning a conventional single-mass gyroscope, to achieve the precision tuning in a dual-mass sensor, without losing advantages of increased DOF of the system. The presented frequency trimming technique is based on assessing the modes mismatch and cross-coupling between modes by means of fitting the experimental frequency response curves to the analytical solutions of the dual-mass system in presence of imperfections. The tuning algorithm involves two steps. First, the stiffness mismatch along the two axes and the anisoelasticity angles α and β are identified, then the tuning DC voltages for modification of diagonal, off-diagonal, and coupling terms in the stiffness matrix are chosen. The method of electrostatic tuning was validated through the experimental characterization of a dual-mass dynamically amplified gyroscope, where the coupling between the two operational modes was minimized and frequency split was reduced from 26 Hz down to 50 mHz, resulting in 17.5× increase in the gyroscope scale factor and significantly improved noise characteristics. The presented electrostatic compensation method is suitable for both off-line and on-line calibration