2,495 research outputs found

    Integration of GaInP/GaAs heterojunction bipolar transistors and high electron mobility transistors

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    Integration of carbon-doped GaInP/GaAs heterojunction bipolar transistors (HBT's) and high electron mobility transistors (HEMT's) is demonstrated by growing an HBT on the top of a HEMT. A current gain of 60. a cutoff frequency of 59 GHz and a maximum oscillation frequency of 68 GHz were obtained for a 5 × 15 μm 2 self-aligned HBT. The HEMT with a gate length of 1.5 μm has a transconductance of 210 mS/mm, a cutoff frequency of 9 GHz and a maximum oscillation frequency of 22 GHz. It is shown that the GaInP/GaAs HBT on the HEMT is the simple Bi-FET tecnology suitable for microwave and mixed single applications.published_or_final_versio

    Thermal stability of current gain in InGaP/GaAsSb/GaAs double-heterojunction bipolar transistors

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    The thermal stability of current gain in InGaP/GaAsSb/GaAs double-heterojunction bipolar transistors (DHBTs) is investigated. The experimental results show that the current gain in the InGaP/GaAsSb/GaAs DHBTs is nearly independent of the substrate temperature at collector current densities > 10 A/cm2, indicating that the InGaP/GaAsSb/GaAs DHBTs have excellent thermal stability. This finding suggests that the InGaP/GaAsSb/GaAs DHBTs have larger emitter-base junction valence-band discontinuity than traditional GaAs-based HBTs. © 2004 American Institute of Physics.published_or_final_versio

    Low turn-on voltage InGaP/GaAsSb/GaAs double HBTs grown by MOCVD

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    A novel InGaP/GaAs0.92Sb0.08/GaAs double heterojunction bipolar transistor (DHBT) with low turn-on voltage has been fabricated. The turn-on voltage of the DHBT is typically 150 mV lower than that of the conventional InGaP/GaAs HBT, indicating that GaAsSb is a suitable base material for reducing the turn-on voltage of GaAs HBTs. A current gain of 50 has been obtained for the InGaP/GaAs0.92Sb0.08/GaAs DHBT. The results show that InGaP/GaAsSb/GaAs DHBTs have a great potential for reducing operating voltage and power dissipation.published_or_final_versio

    Novel InGaP/GaAsSb/GaAs DHBTs

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    A study of the InGaP/GaAsSb/GaAs double heterojunction bipolar transistor (DHBT) is presented. Novel device structure is designed. A fully strained pseudomorphic GaAsSb with 8.0% Sb composition is used as the base layer, while an InGaP layer as the emitter which both eliminates the misfit dislocations and increases the valence band discontinuity at the InGaP/GaAsSb interface. A current gain of 22.6 has been obtained from the InGaP/GaAsSb/GaAs DHBT. Typical turn-on voltage of the device is 0.973 V which is 0.116V lower than that of traditional InGaP/GaAs HBT. Moreover, the current transport mechanism of the InGaP/GaAsSb/GaAs DHBTs is investigated. These results show that GaAsSb is a promising base material for reducing the turn-on voltage of GaAs HBTs.published_or_final_versio

    Current transport mechanism in InGaP/GaAsSb/GaAs double-heterojunction bipolar transistors

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    We have developed InGaP/GaAsSb/GaAs double-heterojunction bipolar transistors (DHBTs) with low turn-on voltage and high current gain by using a narrow energy bandgap GaAsSb layer as the base and an InGaP layer as the emitter. The current transport mechanism is examined by measuring both of the terminal currents in forward and reverse mode. The results show that the dominant current transport mechanism in the InGaP/GaAsSb/GaAs DHBTs is the transport of carriers across the base layer. This finding suggests that the bandgap offset produced by incorporating Sb composition into GaAs mainly appears on the valence band and the conduction-band offset in InGaP/GaAsSb heterojunction is very small. © 2004 American Institute of Physics.published_or_final_versio

    CCl4-doped semi-insulating InP as a buffer layer in GaInAs/InP high electron mobility transistors

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    The application of CCl4-doped semi-insulating InP as a buffer layer in a pseudomorphic Ga0.2In0.8P/Ga0.47In0.53As/InP high electron mobility transistor (HEMT) grown by metalorganic chemical vapor deposition is reported. This Al-free InP-base HEMT with a gate length of 1.3 μm has extrinsic transconductances of 420 and 610 mS/mm at 300 and 77 K, respectively. A cutoff frequency of 15 GHz and a maximum oscillation frequency of 40 GHz are obtained. The results demonstrate the CCl4-doped semi-insulating InP is a promising buffer layer for InP-based HEMT. © 1996 American Institute of Physics.published_or_final_versio

    A high-frequency GaInP/GaAs heterojunction bipolar transistor with reduced base-collector capacitance using a selective buried sub-collector

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    A C-doped GaInP/GaAs HBT using a selective buried sub-cellular has been fabricated by two growth steps. The device was fabricated with minimum overlap of the extrinsic base reduced to about half of that of an HBT without selective buried sub-collector while the base resistance remains unchanged. A current gain of 35, f T of 50 GHz and f max of 140 GHz are obtained with this technology.published_or_final_versio

    Temperature dependence of current gain of GalnP/GaAs heteroj unction and heterostructure-emitter bipolar transistors

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    The temperature effect on current gain is presented for GalnP/GaAs heterojunction and heterostructure-emitter bipolar transistors (HBT's and HEBT's). Experimental results showed that the current gain of the HEBT increases with the increase of temperature in the temperature range of 25-125 °C and decreases slightly at temperatures above 150 °C. The smaller the collector current, the larger is the positive differential temperature coefficient. At high current levels, the current gain dependence on temperature is significantly reduced. On the other hand, a large negative coefficient is observed in the HBT in all current range. This finding indicates that the HEBT is a better candidate than the HBT for power devices. © 1999 IEEE Publisher Item Identifier S 0018-9383(99)00257-9.published_or_final_versio

    Carbon-doped GaInP/GaAs heterojunction bipolar transistors grown by metalorganic chemical vapor deposition using nitrogen as the carrier gas

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    The use of nitrogen as the carrier gas in metalorganic chemical vapor deposition (MOCVD) for the growth of carbon-doped GaInP/GaAs heterojunction bipolar transistors (HBTs) is reported. The material quality grown using a nitrogen carrier gas is the same as that of using a hydrogen carrier gas. High carbon doping and hole concentrations of 3 × 1020 and 2 × 1020 cm-3 in GaAs were obtained. The fabricated HBTs showed very good DC and RF performances indicating that nitrogen can be a promising carrier gas for MOCVD growth. © 1997 American Institute of Physics.published_or_final_versio

    InGaP/GaAsSb/GaAs DHBTs with low turn-on voltage and high current gain

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    An InGaP/GaAsSb/GaAs double heterojunction bipolar transistor (DHBT) is presented. It features the use of a fully strained pseudomorphic GaAsSb (Sb composition: 10.4%) as the base layer and an InGaP layer as the emitter, which both eliminates the misfit dislocations and increases the valence band discontinuity at the InGaP/GaAsSb interface. A current gain of 200 has been obtained from the InGaP/GaAsSb/GaAs DHBT, which is the highest value obtained from GaAsSb base GaAs-based HBTs. The turn-on voltage of the device is typically 0.914 V for the 10.4% Sb composition, which is 0.176V tower than that of traditional InGaP/GaAs HBT. The results show that GaAsSb is a suitable base material for reducing the turn-on voltage of GaAs HBTs.published_or_final_versio
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