Distribution of D1 dislocation luminescence centers in Si+-implanted silicon and the photoluminescence model

Using step-by-step removal of silicon layers, in which dislocation-related photoluminescence is observed after Si+ (100 keV, 1·1015 cm−2) ion implantation followed by high-temperature annealing in a chlorine containing atmosphere, it has been found that a majority of dislocation-related centers of luminescence at ~1.5 μm (D1 line) is localized at the depths of Si+ ion ranges. Cross-sectional electron microscopy shows that the dislocations introduced by the implantation treatment (implantation plus annealing) penetrate to depths of ~1 μm. A phenomenological model of the D1-line dislocation-related luminescence is developed based on the assumption that the K-centers and modified A-centers located in the atmospheres of dislocations are responsible for this luminescence line. The temperature dependence of luminescence intensity calculated on the basis of the model fits well the experimental data for the D1 line

Effect of Si+ ion implantation in α-Ga2O3 films on their gas sensitivity

The effect of the Si+ ion implantation on the gas-sensing properties of single-crystal (0001) α-Ga2O3 films grown by halide vapor phase epitaxy (HVPE) has been studied. It is established that irradiation with a dose of 8 × 1012– 8 × 1015 cm−2 at an energy of 100 keV followed by postimplantation annealing increases the response of α-Ga2O3 films to 3 vol% of H2 by 43 times at 400 ◦C, reduces the response time by a factor of 6, and expands the operating temperature range down to 30 ◦C. In addition, α-Ga2O3 layers irradiated with a Si+ ion dose of 8 × 1013–8 × 1015 cm−2 demonstrate high sensitivity to CO and NH3 gases. The mechanism of Si+ ion irradiationeffect on the gas-sensingproperties of α-Ga2O3 structures is proposed

Silicon-Compatible Memristive Devices Tailored by Laser and Thermal Treatments

Nowadays, memristors are of considerable interest to researchers and engineers due to the promise they hold for the creation of power-efficient memristor-based information or computing systems. In particular, this refers to memristive devices based on the resistive switching phenomenon, which in most cases are fabricated in the form of metal–insulator–metal structures. At the same time, the demand for compatibility with the standard fabrication process of complementary metal–oxide semiconductors makes it relevant from a practical point of view to fabricate memristive devices directly on a silicon or SOI (silicon on insulator) substrate. Here we have investigated the electrical characteristics and resistive switching of SiOx- and SiNx-based memristors fabricated on SOI substrates and subjected to additional laser treatment and thermal treatment. The investigated memristors do not require electroforming and demonstrate a synaptic type of resistive switching. It is found that the parameters of resistive switching of SiOx- and SiNx-based memristors on SOI substrates are remarkably improved. In particular, the laser treatment gives rise to a significant increase in the hysteresis loop in I–V curves of SiNx-based memristors. Moreover, for SiOx-based memristors, the thermal treatment used after the laser treatment produces a notable decrease in the resistive switching voltage