Advances in Non-Contact Thermal-Wave Imaging with Infrared Detection

We are making further advances in non-destructive and non-contact thermal imaging with infrared detection. We employ a chopped and scanned electron beam as heat source, a cooled HgCdTe infrared detector as temperature sensor, and digital processing of the measured temperature pattern for display and storage. The results give a convincing, high contrast image of subsurface structures

Radiation Defect-Induced Lattice Contraction of InP

We studied the lattice strain induced in the MeV ion bombarded InP crystals and the annealing behaviors of lattice strain, Raman line shift, and linewidth. The lattice spacing for the planes parallel to the surface decreases as a result of irradiation, and amounts to a strain of −0.061% for (100) face, −0.056% for (110) face, and −0.050% for (111) face for 15 MeV Cl bombarded samples to a dose of 1.25E15 ions/cm^2. The negative lattice strain, Raman line shift, and line width completely recover at 450°C, and show a major recovery stage at 250°C – 350°C

A Combined Exponential-Power-Law Method for Interconversion between Viscoelastic Functions of Polymers and Polymer-Based Materials

Understanding and modeling the viscoelastic behavior of polymers and polymer-based materials for a wide range of quasistatic and high strain rates is of great interest for applications in which they are subjected to mechanical loads over a long time of operation, such as the self-weight or other static loads. The creep compliance and relaxation functions used in the characterization of the mechanical response of linear viscoelastic solids are traditionally determined by conducting two separate experiments—creep tests and relaxation tests. This paper first reviews the steps involved in conducting the interconversion between creep compliance and relaxation modulus in the time domain, illustrating that the relaxation modulus can be obtained from the creep compliance. This enables the determination of the relaxation modulus from the results of creep tests, which can be easily performed in pneumatic equipment or simple compression devices and are less costly than direct relaxation tests. Some existing methods of interconversion between the creep compliance and the relaxation modulus for linear viscoelastic materials are also presented. Then, a new approximate interconversion scheme is introduced using a convenient Laplace transform and an approximated Gamma function to convert the measured creep compliance to the relaxation modulus. To demonstrate the accuracy of the fittings obtained with the method proposed, as well as its ease of implementation and general applicability, different experimental data from the literature are used

High-performance liquid-chromatographic mass-spectrometric analysis of oligosaccharides from enzymatic digestion of glycosaminoglycans - application to human samples.

Glycosaminoglycan contents were evaluated in plasma and urine samples from volunteers treated intravenously with a mixture of dermatan sulphate and heparin, combining a novel liquid chromatographic-mass spectrometric technique for the determination of oligosaccharides from glycosaminoglycans with a classical technique for the extraction of glycosaminoglycans from biological samples (precipitation with cetylpyridinium chloride). In plasma samples dermatan sulphate and heparin can be measured for 2 h after treatment; urine excretion was detectable for 24 h. These results suggest that this novel approach is promising for future studies on the pharmacokinetics of glycosaminoglycans, although some technical aspects need further improvement, mainly regarding the procedures for sample clean-up; cetylpiridinium precipitation is a complex procedure and the recovery is limited

Characterization of the chemical-structure of sulfated glycosaminoglycans after enzymatic digestion - application of liquid-chromatography mass-spectrometry with an atmospheric-pressure interface

Pneumatically assisted electrospray was demonstrated to be a powerful ionization source for the analysis of oligosaccharides. A mass spectrometer was interfaced to an HPLC system, using this interface, to determine oligosaccharides from the enzymatic digestion of heparin separated on a reversed-phase column. To set up the technique, and particularly to clarify the ionization process, purified disaccharides, from enzymatic digestion of chondroitin sulphates, were measured. The use of a suitable counter ion in the mobile phase, tetrapropylammonium (TPA), to optimize the HPLC separation, gave, with sulphated di- and oligosaccharides, adducts [M + nTPA - (n + m)H]m-, which were unexpectedly stable to fragmentation; molecular ions [M - (n + 1)H]n-, in the presence of the counter ion, were observed only with desulphated or monosulphated disaccharides. The stability of the adducts and the use of a deuterated ion-pair reagent permitted an exact evaluation of the molecular masses of disaccharides and oligosaccharides of unknown structure. Spectra obtained in the absence of the counter ion contained singly or multiply charged molecular ions and fragmentation ions mainly from loss of the sulphate groups; under these ionization conditions the exact mass determination and interpretation of the spectra were difficult. After removal of the counter ion, tandem mass spectra could be obtained with some interesting data for the characterization of these molecules. Complete spectral analyses were performed with amounts of samples of 50 mug but, using microbore columns, one twentieth of this amount may give good spectra

Entrepreneurs and Labours: Chinese New Migrants in Cambodia

The scanning electron microscope (SEM) has unique capabilities for high resolution examination of surface structure and composition. Due to the resolution limits of optical inspection techniques, the semiconductor manufacturing industry has become a rapidly expanding field for SEM applications. As microcircuit groundrules (minimum feature sizes) continue to shrink below one micrometer non-optical measurement methods such as scanning electron microscopy must play an increasingly important role in the inspection of semiconductor device structures at various stages during their fabrication [1,2]. The measurement of structure dimensions such as circuit linewidths (or the spaces between lines) [3] and the measurement of circuit overlay [4] requires a minimum resolution of better than 1/10 groundrule dimensions. In fact, many manufacturing line managers state their resolution requirement as less than 1/20 groundrule dimensions, particularly during the development of a new process. Similarly, it is now apparent from device failure analysis that defects as small as 1/10 groundrule dimensions must also be detected and measured