Method of Attaching Strain Gauges to Various Materials

A method is provided to bond strain gauges to various materials. First, a tape with an adhesive backing is placed across the inside of the fixture frame. The strain gauge is flatly placed against the adhesive backing and coated with a thin, uniform layer of adhesive. The tape is then removed from the fixture frame and placed, strain gauge side down, on the material to be tested. If the material is a high reluctance material, the induction heating source is placed on the tape. If the material is a low reluctance material, a plate with a ferric side and a rubber side is placed, ferric side down, onto the tape. The induction heating source is then placed upon the rubber side. If the material is an insulator material, a ferric plate is placed on the tape. The induction heating source is then placed on the ferric plate. The inductive heating source then generates frequenty from 60 to 70 kilocycles to inductively heat either low reluctance material, ferric side, of ferric plate and provides incidental pressure of approximately five pounds per square inch to the tape for two minutes, thoroughly curing the adhesive. The induction heating source, and, if necessary, the plate or ferric plate, are then removed from the tape after one minute. The tape is then removed from the bonded strain gauge

Rapid induction bonding of composites, plastics, and metals

The Toroid Bonding Gun is and induction heating device. It is a self contained, portable, low powered induction welding system developed for bonding or joining plastic, ceramic, or metallic parts. Structures can be bonded in a factory or in a the field. This type of equipment allows for applying heat directly to the bond lines and/or to the adhesives without heating the entire structure, supports, and fixtures of a bonding assembly. The induction heating gun originally developed for use in the fabrication of space Gangs of bonders are now used to rapidly join composite sheet and structural components. Other NASA-developed applications of this bonding technique include the joining of thermoplastic composites, thermosetting composites, metals, and combinations of these materials

Ceramic susceptor for induction bonding of metals, ceramics, and plastics

A thin (.005) flexible ceramic susceptor (carbon) was discovered. It was developed to join ceramics, plastics, metals, and combinations of these materials using a unique induction heating process. Bonding times for laboratory specimens comparing state of the art technology to induction bonding were cut by a factor of 10 to 100 times. This novel type of carbon susceptor allows for applying heat directly and only to the bondline without heating the entire structure, supports, and fixtures of a bonding assembly. The ceramic (carbon film) susceptor produces molten adhesive or matrix material at the bond interface. This molten material flows through the perforated susceptor producing a fusion between the two parts to be joined, which in many instances has proven to be stronger than the parent material. Bonding can be accomplished in 2 minutes on areas submitted to the inductive heating. Because a carbon susceptor is used in bonding carbon fiber reinforced plastics and ceramics, there is no radar signature or return making it an ideal process for joining advanced aerospace composite structures

One-step dual purpose joining technique

This fastener used in induction heating is a wire screen basically of an eddy current carrying material such as carbon steel. Selected wires in the screen are copper, sheathed in an insulating material. The screen is placed between two sheets of thermoplastics. When inductively heated, the composite softens and flows around the apertures of the screen. After this heating and joining, the copper wires may be used to conduct electricity

On-board timeline validation and repair : a feasibility study

We report on the progress and outcome of a recent ESAfunded project (MMOPS) designed to explore the feasibility of on-board reasoning about payload timelines. The project sought to examine the role of on-board timeline reasoning and the operational context into which it would fit. We framed a specification for an on-board service that fits with existing practices and represents a plausible advance within sensible constraints on the progress of operations planning. We have implemented a prototype to demonstrate the feasibility of such a system and have used it to show how science gathering operations might be improved by its deployment

Magnetodielectric coupling in Mn3O4

We have investigated the dielectric anomalies associated with spin ordering transitions in the tetragonal spinel Mn$_3$O$_4$, using thermodynamic, magnetic, and dielectric measurements. We find that two of the three magnetic ordering transitions in Mn$_3$O$_4$ lead to decreases in the temperature dependent dielectric constant at zero applied field. Applying a magnetic field to the polycrystalline sample leaves these two dielectric anomalies practically unchanged, but leads to an increase in the dielectric constant at the intermediate spin-ordering transition. We discuss possible origins for this magnetodielectric behavior in terms of spin-phonon coupling. Band structure calculations suggest that in its ferrimagnetic state, Mn$_3$O$_4$ corresponds to a semiconductor with no orbital degeneracy due to strong Jahn-Teller distortion.Comment: 6 pages, 7 figure