Supercube grains leading to a strong cube texture and a broad grain size distribution after recrystallization

This work revisits the classical subject of recrystallization of cold-rolled copper. Two characterization techniques are combined: three-dimensional X-ray diffraction using synchrotron X-rays, which is used to measure the growth kinetics of individual grains in situ, and electron backscatter diffraction, which is used for statistical analysis of the microstructural evolution. As the most striking result, the strong cube texture after recrystallization is found to be related to a few super large cube grains, which were named supercube grains. These few supercube grains become large due to higher growth rates. However, most other cube grains do not grow preferentially. Because of the few supercube grains, the grain size distribution after recrystallization is broad. Reasons for the higher growth rates of supercube grains are discussed, and are related to the local deformed microstructure

Band Positions Used for On-Line Crystallographic Orientation Determination from Electron Back Scattering Patterns

A computer procedure for on-line analysis of electron back scattering patterns (EBSP) has been developed. An experimental EBSP is computer recorded and displayed on a computer monitor. The user identifies the positions of at least two bands in the EBSP with a cursor. Based on this input the computer calculates possible crystallographic orientations. The corresponding EBSPs are simulated and superimposed on the experimental EBSP. The correct crystallographic orientation is determined from a comparison between the experimental and simulated EBSPs. Typically, the analysis takes a 10-30 seconds per pattern. Advantages with the present procedure are that it can be applied for any crystal symmetry, that it requires no knowledge about electron diffraction maps, that it can be used for EBSPs with relatively low contrast, and that the indexing is very precise. For relative orientation measurements the accuracy is found to be within range 0.05°-0.20°, whereas, for repeated measurements of a given grain after complete remounting of sample and EBSP equipment, it was determined to be 0.5°. Furthermore, the procedure facilitates fully automatic pattern recognition