298 research outputs found

    Improved red color with cholesteric liquid crystals in Bragg reflection mode

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    The helical pitch of the cholesteric liquid crystal (CLC) can be adjusted to reflect the colors red, green, and blue. Additive mixing of these colors in displays results in multicolor images and it is easy to use pure primary blue and green colors, but the red color is in general very unsaturated. We show by simulations that this poor red color performance is due to reflection sidebands on the smaller wavelength side of the normal red Bragg reflection band. We discuss five approaches to improve the red color performance, namely, two types of spectral filtering (dyes or filters), a very low birefringence CLC, a gradient in the birefringence of the CLC, and the use of a bluish reflector. The two methods of spectral filtering are also experimentally tested. © 2002 Society of Photo-Optical Instrumentation Engineers

    Applications of SOI-based optical MEMS

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    After microelectromechanical systems (MEMS) devices have been well established, components of higher complexity are now developed. Particularly, the combination with optical components has been very successful and have led to optical MEMS. The technology of choice for us is the silicon-on-insulator (SOI) technology, which has also been successfully used by other groups. The applications presented here give an overview over what is possible with this technology. In particular, we demonstrate four completely different devices: a) a 2 × 2 optical cross connector (OXC) with an insertion loss of about 0.4 dB at a switching time of 500 μs and its extension to a 4 × 4 OXC, b) a variable optical attenuators (VOA), which has an attenuation range of more than 50 dB, c) a Fourier transform spectrometer (FTS) with a spectral resolution of 6 nm in the visible, and d) an accelerometer with optical readout that achieves a linear dynamic range of 40 dB over ±6 g. Except for the FTS, all the applications utilized optical fibers, which are held and self-aligned within the MEMS component by U-grooves and small leaf springs. All devices show high reliability and a very low power consumption
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