5 research outputs found
Recommended from our members
Thin-film VCSEL and optical interconnection layer fabrications for fully embedded board level optical interconnects
textSemiconductor technology has been splendid evolved. As a consequence of,
massive data traffic is required in system level. However copper based interconnection
reached the upper limit of data transfer rate and can not provide enough bandwidth for
high performance system. Copper based interconnection in long haul application was
replaced to optical fiber. Optical interconnection in system level is generally considered
as an alternative to provide high bandwidth. However, unlike long haul application,
optical interconnection in system level encountered many problems such as
compatibility, robustness and packaging difficulty. The compatibility to current electrical
board system and packaging difficulty must be solved.
This dissertation describes a fully embedded board level optical interconnection,
which can solve many problems, components fabrication and hybrid integration with
electrical layers. Thin-film VCSEL array and flexible optical waveguide are
demonstrated. The optical interconnection layer integrated with thin-film VCSEL and
photo-detector arrays is demonstrated.Electrical and Computer Engineerin
Recommended from our members
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.Board of Regents, University of Texas Syste