400 Gb/s silicon photonic transmitter and routing WDM technologies for glueless 8-socket chip-to-chip interconnects

Arrayed Waveguide Grating Router (AWGR)-based interconnections for Multi-Socket Server Boards (MSBs) have been identified as a promising solution to replace the electrical interconnects in glueless MSBs towards boosting processing performance. In this article, we present an 8-socket glueless optical flat-topology Wavelength Division Multiplexing (WDM)-based point-to-point (P2P) interconnect pursued within the H2020 ICT project ICT-STREAMS and we report on our latest achievements in the deployment of the constituent silicon (Si)-photonic transmitter and routing building blocks, exploiting experimentally obtained performance metrics for analyzing the 8-socket chip-to-chip (C2C) connectivity in terms of throughput and energy efficiency. We demonstrate an 8-channel WDM Si-photonic microring-based transmitter (Tx) capable of providing 400 (8 x 50) Gb/s non-return-to-zero (NRZ) Tx capacity and an 8 x 8 Coarse-WDM (CWDM) Si-AWGR with verified cyclic data routing capability in O-band. Following an overview of our recently demonstrated crosstalk (XT)-aware wavelength allocation scheme, that enables fully-loaded AWGR-based interconnects even for typical sub-optimal XT values of silicon integrated CWDM AWGRs, we validate the performance of a full-scale 8-socket interconnect architecture through physical layer simulations exploiting experimentally-verified simulation models for the underlying Si-photonic Tx and routing circuits. This analysis reveals a total aggregate capacity of 1.4 Tb/s for an 8-socket interconnect when operating with 25 Gb/s line-rates, which can scale to 2.8 Tb/s at an energy efficiency of just 5.02 pJ/bit by exploiting the experimentally verified building block performance at 50 Gb/s line. This highlights the perspectives for up to 69% energy savings compared to the standard QuickPath Interconnect (QPI) typically employed in electronic glueless MSB interconnects, while scaling the single-hop flat connectivity from 4- to 8-socket interconnection systems

Silicon circuits for chip-to-chip communications in multi-socket server board interconnects

Multi-socket server boards (MSBs) exploit the interconnection of multiple processor chips towards forming powerful cache coherent systems, with the interconnect technology comprising a key element in boosting processing performance. Here, we present an overview of the current electrical interconnects for MSBs, outlining the main challenges currently faced. We propose the use of silicon photonics (SiPho) towards advancing interconnect throughput, socket connectivity and energy efficiency in MSB layouts, enabling a flat-topology wavelength division multiplexing (WDM)-based point-to-point (p2p) optical MSB interconnect scheme. We demonstrate WDM SiPho transceivers (TxRxs) co-assembled with their electronic circuits for up to 50 Gb/s line rate and 400 Gb/s aggregate data transmission and SiPho arrayed waveguide grating routers that can offer collision-less time of flight connectivity for up to 16 nodes. The capacity can scale to 2.8 Gb/s for an eight-socket MSB, when line rate scales to 50 Gb/s, yielding up to 69% energy reduction compared with the QuickPath Interconnect and highlighting the feasibility of single-hop p2p interconnects in MSB systems with >4 sockets

A 5G C-RAN Optical Fronthaul Architecture for Hotspot Areas Using OFDM-Based Analog IFoF Waveforms

Analog fronthauling is currently promoted as a bandwidth and energy-efficient solution that can meet the requirements of the Fifth Generation (5G) vision for low latency, high data rates and energy efficiency. In this paper, we propose an analog optical fronthaul 5G architecture, fully aligned with the emerging Centralized-Radio Access Network (C-RAN) concept. The proposed architecture exploits the wavelength division multiplexing (WDM) technique and multicarrier intermediate-frequency-over-fiber (IFoF) signal generation per wavelength in order to satisfy the demanding needs of hotspot areas. Particularly, the fronthaul link employs photonic integrated circuit (PIC)-based WDM optical transmitters (Txs) at the baseband unit (BBU), while novel reconfigurable optical add-drop multiplexers (ROADMs) cascaded in an optical bus are used at the remote radio head (RRH) site, to facilitate reconfigurable wavelength switching functionalities up to 4 wavelengths. An aggregate capacity of 96 Gb/s has been reported by exploiting two WDM links carrying multi-IF band orthogonal frequency division multiplexing (OFDM) signals at a baud rate of 0.5 Gbd with sub-carrier (SC) modulation of 64-QAM. All signals exhibited error vector magnitude (EVM) values within the acceptable 3rd Generation Partnership Project (3GPP) limits of 8%. The longest reach to place the BBU away from the hotspot was also investigated, revealing acceptable EVM performance for fiber lengths up to 4.8 km