Test beam results of ITk pixel sensors for the new ATLAS ITk detector

The Inner Tracker (ITk) of the ATLAS detector must withstand extreme radiation conditions at the High Luminosity LHC (HL-LHC). 3D sensors are selected technology for the innermost detector layers as their radiation tolerance are superior to that of conventional planar pixel sensors. To optimize material budget and overall cost the outer layers use planar pixel sensors. We present an efficiency analysis of SINTEF 3D and planar quad KEK (HPK) silicon sensors. Results show high efficiencies above 1.0e+16 neq.cm-2 for 3D sensors and 4.31e+15 neq.cm-2 for planar sensors

ATLAS ITk Pixel Pre-production Planar Sensor Characterisation for the HL-LHC Upgrade

In the ATLAS detector upgrade for the High-Luminosity LHC (HL-LHC), the current Inner Detector will be replaced with an all-silicon Inner Tracker (ITk), to operate under higher occupancy (instantaneous luminosity $7.5\times10^{34}\;\rm cm^{-2}s^{-1}$, which corresponds to about 200 inelastic pp collisions per bunch crossing) and radiation damage (particle fluence up to $2\times10^{16}\;\rm n_{eq}/cm^2$). The data taking is planned to start in 2029 and last for 10\,years. The innermost part of the ITk will be equipped with pixel modules, consisting of pixel sensors and novel ASICs, implemented in 65\,nm CMOS technology. The ITk project is currently in pre-production stage. To assure that specifications will be met during production, sensors and test structures from different vendors were sent to different sites for irradiation, hybridisation and follow-up testing. This paper presents the results of the characterisation of the pre-production planar sensor for ITk

ATLAS ITk Pixel Pre-production Planar Sensor Characterisation for the HL-LHC Upgrade

International audienceIn the ATLAS detector upgrade for the High-Luminosity LHC (HL-LHC), the current Inner Detector will be replaced with an all-silicon Inner Tracker (ITk), to operate under higher occupancy (instantaneous luminosity $7.5\times10^{34}\;\rm cm^{-2}s^{-1}$, which corresponds to about 200 inelastic pp collisions per bunch crossing)and radiation damage (particle fluence up to $2\times10^{16}\;\rm n_{eq}/cm^2$). The data taking is planned to start in 2029 and last for 10$\,$years. The innermost part of the ITk will be equipped with pixel modules, consisting of pixel sensors and novel ASICs, implemented in 65$\,$nm CMOS technology. The ITk project is currently in pre-production stage.To assure that specifications will be met during production, sensors and test structures from different vendors were sent to different sites for irradiation, hybridisation and follow-up testing. This paper presents the results of the characterisation of the pre-production planar sensor for ITk

Test Beam Results of SINTEF 3D Pixel Silicon Sensorsb

This paper presents test beam results of SINTEF 3D pixel sensors designed for the Inner Tracker (ITk) of the ATLAS detector at the High Luminosity LHC (HL-LHC). The sensors are required to withstand extreme radiation doses and to maintain efficiency above 96-97% after a lifetime operation at the ITk. We present details on the production and design of these sensors, the setup for the experiment at CERN, and the analysis of the test beam data. Results are promising, showing excellent position resolution and high efficiencies after irradiation. The sensors meet the operational efficiency targets for both perpendicular and tilted configurations, validating their design and performance for future HL-LHC operations