The Inner Tracker (ITk) of the ATLAS detector must withstand extreme radiation conditions at the High Luminosity LHC (HL-LHC). 3D sensors are selected technology for the innermost detector layers as their radiation tolerance are superior to that of conventional planar pixel sensors. To optimize material budget and overall cost the outer layers use planar pixel sensors. We present an efficiency analysis of SINTEF 3D and planar quad KEK (HPK) silicon sensors. Results show high efficiencies above 1.0e+16 neq.cm-2 for 3D sensors and 4.31e+15 neq.cm-2 for planar sensors