34 research outputs found

    The new MMT

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    ABSTRACT Originally commissioned in 1979, the Multiple Mirror Telescope was a highly innovative and successful facility that pioneered many of the technologies that are used in the new generation of 8 to 10 m class telescopes. After 19 years of operations the MMT was decommissioned in March of 1998: the enclosure was modified, the optics support structure was replaced, and a single 6.5-meter primary mirror was installed and aluminized in-situ. First light for the new MMT was celebrated on May 13, 2000. Operations began with an f/9 optical configuration compatible with existing instruments. Work has continued commissioning two new optical configurations that will serve a suite of new instruments: an f/15 deformable secondary mirror and adaptive optics facility that has obtained diffraction-limited images; and an f/5.4 secondary mirror and refractive corrector that provides a one-degree diameter field of view. The wide-field instrument suite includes two fiber-fed bench spectrographs, a robotic fiber positioner, and a wide-field imaging camera

    Modelling Quasi-Periodic Pulsations in Solar and Stellar Flares

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    A New Periodic Displacement Method Applied to Electrodeposition of Cu-Ag Alloys

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    ABSTRACT A new method is described for preparing multilayered alloys by periodically interrupting electrodeposition of the less noble metal to permit electroless displacement of a portion of the electrodeposited material by the more noble component. Visibly smooth, nodule-free Cu-Ag alloys of controlled composition have been prepared and shown to exhibit excellent tensile properties. The Ag displacement layers grow epitaxially on Cu(111) planes, which are preferentially aligned parallel with the cathode surface for the cyanide bath studied. In addition, periodic displacement deposition of multilayered structures potentially represents a sensitive means for studying the kinetics of such displacement reactions. Metals having significantly different reduction potentials are often difficult to electrodeposit as alloys since deposition of the more noble component is generally too fast at the more negative potentials required for deposition of the less noble component. Use of diffusion-limited deposition of the more noble metal typically results in nodule formation and poor deposit properties, and does not provide adequate control over the deposit composition under practically attainable hydrodynamic conditions. When the two metals are immiscible, the situation is expected to be exacerbated by the enhanced tendency toward agglomeration of the individual components and island formation. Consequently, controlled electrodeposition of Cu-Ag alloys, for example, has remained an elusive goal (1). Electrodeposition of multilayered structures from a single bath (2) is also difficult to attain when the deposition potentials are far apart, especially when the deposition process for the less noble component is highly reversible (3). In the present paper, we describe a special pulse plating method by which these difficulties are circumvented. Experimental The two liter cyanide bath employed in the present work contained 60 grams per liter (g/l) CuCN, 102 g/1 KCN, 15 g/1 potassium carbonate, 15 g/l KOH, 45 g/1 potassium sodium tartrate (Rochelle salt), and 34 milligrams per liter (mg/1) (0.25mM) AgCN, and was maintained at 60~ in a water-jacketed cell. All chemicals were reagent grade. Deposition was performed on a rotating (750 rpm) 304 stainless steel cylindrical mandrel (2.5 cm diameter, 7.6 cm long) sandwiched between chlorofluorocarbon plastic end pieces (4). The anode was a concentric platinized Ti mesh in the same compartment. A 2-~m thick pyrophosphate Cu basal layer was necessary to prevent intrusion of the cyanide electrolyte between the mandrel and the deposit. Copper electrodeposition was performed at a constant current (-30 mA/cm2). Unless otherwise noted, the "off time" for the displacement reaction was also held constant (18 s), the Ag content of the deposit being varied by adjusting the number of Ag layers (per unit thickness) via the Cu layer thickness. During plating, the bath Ag content was replenished at 15 min intervals by manual injection of a known volume of a stock Ag cyanide solution, and the correct final concentration was verified by atomic absorption (AA) analysis. Plated specimens were nominally 50 ~m thick and were removed from the mandrel by masking off a thin strip of the deposit (parallel to the cylinder axis) and dissolving it in an acid solution. For tensile testing, strips (13 mm wide) cut in the axial direction were clamped between dogboneshaped case hardened steel plates and ground to a dogbone configuration having a reduced section width of 6.3 mm and a gauge length of 2.8 cm. Pull testing was performed at a cross head speed of 0.1 mm/min
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