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31 research outputs found

Plasma Magnetohydrodynamics and Energy Conversion

Author: Brown G. A.
Engelmaier W.
Hoffman M. A.
Jackson W. D.
Kerrebrock J. L.
Lubin B. T.
McNary C. A.
Sachs S.
Solbes A.
Stickney Robert E.
Publication venue: Research Laboratory of Electronics (RLE) at the Massachusetts Institute of Technology (MIT)
Publication date: 15/10/1965
Field of study

Contains reports on five research projects.U. S. Air Force (Research and Technology Division) under Contract AF33(615)-1083 with the Air Force Aero Propulsion Laboratory, Wright-Patterson Air Force Base, Ohi

Figures of Merit Design Tools for Surface Mount Solder Joint Reliability

Author: Clech J-P.
Engelmaier W.
Engelmaier W.
Hall P. M.
Manson S. S.
Miner M. A.
Morrow J. D.
Shine M. C.
Solomon H. D.
W. Engelmaier
Wilcox J. R.
Wild R. N .
Publication venue: 'Emerald'
Publication date
Field of study

Reliability, Thermal and Thermomechanical Characteristics of Polymer‐on‐metal Multilayer Boards

Author: Engelmaier W.
Engelmaier W.
F. Gray
Finke T. E.
Jonas C.
M. Elkins
Measurement
Poradish F.
Prokop J.
Smith G.
Wild R. N.
Publication venue: 'Emerald'
Publication date
Field of study

Use of Thermoplastics and Injection Moulded PWBs

Author: D. Frisch
E. Cleveland
Engelmaier W.
Frisch D. C
Frisch D. C.
Galli E.
Lyman E.
Manzione L.
Pound R.
Publication venue: 'Emerald'
Publication date
Field of study

Simulation of Assembly Generated Constraints on Ceramic Capacitors during SMT Processing and Size Optimisation of the Capacitors by Design of Experiments

Author: Elliot J. G.
Engelmaier W.
Engineering Analysis System' User Manual
L. Bechou
N. Xiong
Riemer D. E.
Y. Ousten
Zardini C
Publication venue: 'Emerald'
Publication date
Field of study

Characterization and Tribological Properties of MoS 2

Author: Adamson A.
Boes D.
De Gee A.
Durbridge C.
Engelmaier W.
Gregg S.
Killeffer D.
MaCabe J.
McCabe J.
Salomon G.
Thiessen P.
Publication venue: 'Informa UK Limited'
Publication date
Field of study

Surface Mounted Joints on Different Substrate Materials

Author: Boswell D.
Brierley C. J.
DeVore J. A.
Engelmaier W.
Krinke T. A.
L.P. Karjalainen
Lau J. H.
M.K. Lahdenperä
R.H. Rautioaho
Tribula D.
Publication venue: 'Emerald'
Publication date
Field of study

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Author: Abtew
Barrett
Chin C. Lee
Chu-Hsuan Sha
Engelmaier
Frear
Gooch
Lee
Lee
Low
Olsen
Park
Suganuma
Taklo M. M. V., Storås
Tsau
Tummala
Publication venue: 'ASME International'
Publication date
Field of study

Failures in Electronic Assemblies and Devices

Author: B Ricco
C Libove
C Libove
C Libove
C-M Hu
D Montgomery
DC Wunsch
DS Chabra
E Suhir
E Suhir
E Suhir
E Suhir
E Volterra
EV Philosky
F Villela
GV Kidson
H Okabayashi
H Wendt
IC Chen
J Gaffeny
J Lee
J Lee
JC Bolger
JC Bolger
JM Hu
JR Black
JR Black
JR Venables
JW McPherson
K Honda
K Honda
KA Danso
KC Norris
KV Ravi
M Liehr
M Pecht
M Pecht
M Shatzkes
MH Woods
MJ Attardo
PC Paris
PSD Lin
RN Wild
RT Howard
RW Coen
RW Kotlowitz
S Holland
TH DiStefano
W Engelmaier
W Engelmaier
W Engelmaier
WE Phillips
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/2001
Field of study

Functional Cycles and Surface Mounting Attachment Reliability

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