Split-cross-bridge resistor for testing for proper fabrication of integrated circuits

An electrical testing structure and method is described whereby a test structure is fabricated on a large scale integrated circuit wafer along with the circuit components and has a van der Pauw cross resistor in conjunction with a bridge resistor and a split bridge resistor, the latter having two channels each a line width wide, corresponding to the line width of the wafer circuit components, and with the two channels separated by a space equal to the line spacing of the wafer circuit components. The testing structure has associated voltage and current contact pads arranged in a two by four array for conveniently passing currents through the test structure and measuring voltages at appropriate points to calculate the sheet resistance, line width, line spacing, and line pitch of the circuit components on the wafer electrically

On Interference Alignment and the Deterministic Capacity for Cellular Channels with Weak Symmetric Cross Links

In this paper, we study the uplink of a cellular system using the linear deterministic approximation model, where there are two users transmitting to a receiver, mutually interfering with a third transmitter communicating with a second receiver. We give an achievable coding scheme and prove its optimality, i.e. characterize the capacity region. This scheme is a form of interference alignment which exploits the channel gain difference of the two-user cell.Comment: Submitted to IEEE International Symposium on Information Theory (ISIT) 2011, 5 page

Asymmetric soft-error resistant memory

A memory system is provided, of the type that includes an error-correcting circuit that detects and corrects, that more efficiently utilizes the capacity of a memory formed of groups of binary cells whose states can be inadvertently switched by ionizing radiation. Each memory cell has an asymmetric geometry, so that ionizing radiation causes a significantly greater probability of errors in one state than in the opposite state (e.g., an erroneous switch from '1' to '0' is far more likely than a switch from '0' to'1'. An asymmetric error correcting coding circuit can be used with the asymmetric memory cells, which requires fewer bits than an efficient symmetric error correcting code

The Rolf of Test Chips in Coordinating Logic and Circuit Design and Layout Aids for VLSI

This paper emphasizes the need for multipurpose test chips and comprehensive procedures for use in supplying accurate input data to both logic and circuit simulators and chip layout aids. It is shown that the location of test structures within test chips is critical in obtaining representative data, because geometrical distortions introduced during the photomasking process can lead to significant intrachip parameter variations. In order to transfer test chip designs quickly, accurately, and economically, a commonly accepted portable chip layout notation and commonly accepted parametric tester language are needed. In order to measure test chips more accurately and more rapidly, parametric testers with improved architecture need to be developed in conjunction with innovative test structures with on-chip signal conditioning

Integrated circuit reliability testing

A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit

Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation

A set of addressable test structures, each of which uses addressing schemes to access individual elements of the structure in a matrix, is used to test the quality of a wafer before integrated circuits produced thereon are diced, packaged and subjected to final testing. The electrical characteristic of each element is checked and compared to the electrical characteristic of all other like elements in the matrix. The effectiveness of the addressable test matrix is in readily analyzing the electrical characteristics of the test elements and in providing diagnostic information