Have Your Cake and Eat It, Too: Engineering Measurements at Fabrication for Channel Design and Process Control

This paper demonstrates the acquisition of advanced circuit board performance parameters from breakaway test coupons measured right at the PCB fabricator. We show how to acquire S-parameter and TDR-based measurements up to 30 GHz using robust probes and test coupon fixtures. The measurements provide pass/fail tests for process control and they provide model parameters as feedback to improve channel design. By way of example, we demonstrate measurements of several representative test coupons, perform total loss tests, such as SET2DIL, and extract design parameters that can be used to improve EDA channel models. We also demonstrate measurement and tests of impedance uniformity and differential delay skew, both of which are influenced by glass weave position and copper fabrication variations. Archiving fundamental S-parameter and TDR measurements allows for further extraction of important design-to-fabrication feedback while in the process of tracking PCB process statistics

Three new high precision tests of relativity and Mach's principle

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Signal integrity characterization techniques

"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and microwave curricula all while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must be designed using today's most powerful analysis and characterization tools.Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements - from backplane for design challenges to error correction techniques to jitter measurement technologies. The authors' approach wisely addresses some of these new high-speed technologies, and it also provides valuable insight into its future direction and will teach the reader valuable lessons on the industry

Which One is Better? Comparing Options to Describe Frequency Dependent Losses

In any channel operating at 2 Gbps and above, conductor and dielectric losses can dominate channel performance. These effects must be included in any accurate system simulation. The problem isn\u27t that simulators don\u27t do this; there are several choices in interconnect loss mathematical expressions and it\u27s difficult to decide how to transform fab information into simulator input. There are different combinations of parameterized mathematical expressions for dielectric and conductor loss which are in popular use in the industry. Each works to some extent. This paper takes each mathematical expression, explains its origin, evaluates its predicted insertion loss magnitude and phase then explores how the expression scales. This is useful when translating test coupon results into accurate simulation predictions