5 research outputs found

    The role of the residual stresses of the epoxy-aluminum interphase on the interfacial fracture toughness

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    When an epoxy-diamine system (DGEBA-IPDA) is applied onto aluminum alloy (5754) and cured, an interphase having chemical, physical, and mechanical properties quite different from those of the bulk polymer is created between the substrate and the part of the polymer having bulk properties. To get a better understanding of the role of the interphase on the interfacial fracture toughness either a tri-layer (bulk coating=interphase=substrate) or a bi-layer model (bulk coating=substrate) were used for quantitative determination of the critical strain energy release rate (noted Gc). Indeed, as the interphase formation results from both dissolution and diffusion phenomena, we were able to control the interphase formation within coated systems by controlling the liquid-solid contact time and then to make tri- or bi-layered systems. The particularity of models used is to consider residual stress profiles developed within the entire system leading to an intrinsic parameter representing the work of adhesion between the polymer and the metallic substrate. The aim of this publication is to clearly establish the role of the interphase mechanical properties, such as Young's modulus and residual stress on the interfacial fracture toughness. Results are presented and discussed for three different aluminum surface treatments (chemical etching, degreasing and anodizing)

    Residual stresses and practical adhesion: effect of organo-metallic complex formation and crystallization

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    Epoxy-amine liquid pre-polymers are often applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. The overall performance of such systems depends on the interphase created between the epoxy amine polymer and the metallic substrate. When epoxyamine liquid mixtures are applied onto a metallic oxide layer, concomitant amine chemisorption and oxide dissolution occur leading to organo-metallic complex formation. Depending on the amine nature, as soon as the organo-metallic complex concentration is higher than the solubility product (e.g., isophoronediamine (IPDA)), these organo-metallic complexes crystallize as sharp needles. At the same time, the uncrystallized organo-metallic complexes react with the epoxy monomer to form, after curing cycle, a new network. Moreover, the crystal size increases with the solid/liquid contact time leading to an increase of intrinsic residual stresses and Young's modulus. When aliphatic diethylenetriamine (DETA) was used, no crystallization occurred, but the interphase formation was observed. The aim of this study was to understand and to establish the role of crystallization of organo-metallic complexes formed within the interphase on the practical adhesion performance. As the crystallization of the organo-metallic complex depends on the nature of the amine, two amine hardeners were used (IPDA inducing the formation of crystals and DETA without formation of crystals). For DGEBA-IPDA systems, the ultimate load decreases while residual stresses increase when the liquid/solid contact time increases. When no crystal formation was observed (e.g., DGEBADETA system), residual stresses, coating Young's modulus and ultimate load values all remained nearly constant irrespective of the liquid/solid contact time
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