4 research outputs found
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Reliability of materials in MEMS : residual stress and adhesion in a micro power generation system.
The reliability of thin film systems is important to the continued development of microelectronic and micro-electro-mechanical systems (MEMS). The reliability of these systems is often tied to the ability of the films to remain adhered to its substrate. By measuring the amount of energy to separate the film from the substrate, researchers can predicts film lifetimes. Recent work has resulted in several different testing techniques to measure this energy including spontaneous buckling, indentation induced delamination and four point bending. This report focuses on developing quantifiable adhesion measurements for multiple thin film systems used in MEMS and other thin film systems of interest to Sandia programs. First, methods of accurately assessing interfacial toughness using stressed overlayer methods are demonstrated using both the W/Si and Au/Si systems. For systems where fracture only occurs along the interface, such as Au/Si, the calculated fracture energies between different tests are identical if the energy put into the system is kept near the needed strain energy to cause delamination. When the energy in the system is greater than needed to cause delamination, calculated adhesion energies can increase by a factor of three due to plastic deformation. Dependence of calculated adhesion energies on applied energy in the system was also shown when comparisons of four point bending and stressed overlayer test methods were completed on Pt/Si systems. The fracture energies of Pt/Ti/SiO{sub 2} were studied using four-point bending and compressive overlayers. Varying the thickness of the Ti film from 2 to 17 nm in a Pt/Ti/SiO{sub 2} system, both test methods showed an increase of adhesion energy until the nominal Ti thickness was 12nm. Then the adhesion energy began to decrease. While the trends in toughness are similar, the magnitude of the toughness values measured between the test methods is not the same, demonstrating the difficulty in extracting mode I toughness as mixed mode loading approaches mode II conditions
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Development of experimental verification techniques for non-linear deformation and fracture.
This project covers three distinct features of thin film fracture and deformation in which the current experimental technique of nanoindentation demonstrates limitations. The first feature is film fracture, which can be generated either by nanoindentation or bulge testing thin films. Examples of both tests will be shown, in particular oxide films on metallic or semiconductor substrates. Nanoindentations were made into oxide films on aluminum and titanium substrates for two cases; one where the metal was a bulk (effectively single crystal) material and the other where the metal was a 1 pm thick film grown on a silica or silicon substrate. In both cases indentation was used to produce discontinuous loading curves, which indicate film fracture after plastic deformation of the metal. The oxides on bulk metals fractures occurred at reproducible loads, and the tensile stress in the films at fracture were approximately 10 and 15 GPa for the aluminum and titanium oxides respectively. Similarly, bulge tests of piezoelectric oxide films have been carried out and demonstrate film fracture at stresses of only 100's of MPa, suggesting the importance of defects and film thickness in evaluating film strength. The second feature of concern is film adhesion. Several qualitative and quantitative tests exist today that measure the adhesion properties of thin films. A relatively new technique that uses stressed overlayers to measure adhesion has been proposed and extensively studied. Delamination of thin films manifests itself in the form of either telephone cord or straight buckles. The buckles are used to calculate the interfacial fracture toughness of the film-substrate system. Nanoindentation can be utilized if more energy is needed to initiate buckling of the film system. Finally, deformation in metallic systems can lead to non-linear deformation due to 'bursts' of dislocation activity during nanoindentation. An experimental study to examine the structure of dislocations around indentations has been carried out to demonstrate the effectiveness in evaluating cross slip and dislocation behavior around nanoindentation impressions in bulk engineering alloys
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Effect of nanoscale patterned interfacial roughness on interfacial toughness.
The performance and the reliability of many devices are controlled by interfaces between thin films. In this study we investigated the use of patterned, nanoscale interfacial roughness as a way to increase the apparent interfacial toughness of brittle, thin-film material systems. The experimental portion of the study measured the interfacial toughness of a number of interfaces with nanoscale roughness. This included a silicon interface with a rectangular-toothed pattern of 60-nm wide by 90-nm deep channels fabricated using nanoimprint lithography techniques. Detailed finite element simulations were used to investigate the nature of interfacial crack growth when the interface is patterned. These simulations examined how geometric and material parameter choices affect the apparent toughness. Atomistic simulations were also performed with the aim of identifying possible modifications to the interfacial separation models currently used in nanoscale, finite element fracture analyses. The fundamental nature of atomistic traction separation for mixed mode loadings was investigated
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Nanomechanics of hard films on compliant substrates.
Development of flexible thin film systems for biomedical, homeland security and environmental sensing applications has increased dramatically in recent years [1,2,3,4]. These systems typically combine traditional semiconductor technology with new flexible substrates, allowing for both the high electron mobility of semiconductors and the flexibility of polymers. The devices have the ability to be easily integrated into components and show promise for advanced design concepts, ranging from innovative microelectronics to MEMS and NEMS devices. These devices often contain layers of thin polymer, ceramic and metallic films where differing properties can lead to large residual stresses [5]. As long as the films remain substrate-bonded, they may deform far beyond their freestanding counterpart. Once debonded, substrate constraint disappears leading to film failure where compressive stresses can lead to wrinkling, delamination, and buckling [6,7,8] while tensile stresses can lead to film fracture and decohesion [9,10,11]. In all cases, performance depends on film adhesion. Experimentally it is difficult to measure adhesion. It is often studied using tape [12], pull off [13,14,15], and peel tests [16,17]. More recent techniques for measuring adhesion include scratch testing [18,19,20,21], four point bending [22,23,24], indentation [25,26,27], spontaneous blisters [28,29] and stressed overlayers [7,26,30,31,32,33]. Nevertheless, sample design and test techniques must be tailored for each system. There is a large body of elastic thin film fracture and elastic contact mechanics solutions for elastic films on rigid substrates in the published literature [5,7,34,35,36]. More recent work has extended these solutions to films on compliant substrates and show that increasing compliance markedly changes fracture energies compared with rigid elastic solution results [37,38]. However, the introduction of inelastic substrate response significantly complicates the problem [10,39,40]. As a result, our understanding of the critical relationship between adhesion, properties, and fracture for hard films on compliant substrates is limited. To address this issue, we integrated nanomechanical testing and mechanics-based modeling in a program to define the critical relationship between deformation and fracture of nanoscale films on compliant substrates. The approach involved designing model film systems and employing nano-scale experimental characterization techniques to isolate effects of compliance, viscoelasticity, and plasticity on deformation and fracture of thin hard films on substrates that spanned more than two orders of compliance magnitude exhibit different interface structures, have different adhesion strengths, and function differently under stress. The results of this work are described in six chapters. Chapter 1 provides the motivation for this work. Chapter 2 presents experimental results covering film system design, sample preparation, indentation response, and fracture including discussion on the effects of substrate compliance on fracture energies and buckle formation from existing models. Chapter 3 describes the use of analytical and finite element simulations to define the role of substrate compliance and film geometry on the indentation response of thin hard films on compliant substrates. Chapter 4 describes the development and application of cohesive zone model based finite element simulations to determine how substrate compliance affects debond growth. Chapter 5 describes the use of molecular dynamics simulations to define the effects of substrate compliance on interfacial fracture of thin hard tungsten films on silicon substrates. Chapter 6 describes the Workshops sponsored through this program to advance understanding of material and system behavior