3,473 research outputs found
Characteristics of Keratoconus Patients at a Tertiary Eye Center in India
Purpose: To evaluate the presentation and characteristics of patients with keratoconus at a tertiary eye care center in Mumbai, India.
Methods: This single center, non-comparative, retrospective cohort analysis was performed on patients with keratoconus who presented to the Clear Vision Eye Center clinic from April 2007 to March 2009. Data was collected to characterize correlations among visual acuity, corneal biomicroscopic findings, and refractive and topographic findings in keratoconus.
Results: Records of 274 patients including 189 male and 85 female subjects with mean age of 20.1±3.5 (range, 13 to 29) years at the time of diagnosis were assessed. There was history of skin allergy in 73 (26.6%), symptomatic ocular allergy in 67 (24.45%) and asthma in 31 (11.31%) patients. The most frequent corneal sign was Fleischer′s ring which was observed in 81% of cases. Corneal topography revealed mean simK (simulated keratometry) of 53.3±6.1 (range, 41.2 to 69.0) diopters. Corneal topography analysis with the Cone Location Magnitude Index disclosed the presence of inferior cones in 93% of patients.
Conclusion: This group of patients had younger age at presentation and more severe keratoconus as compared to western populations; contact lenses were used only in a minority of patients
How do Wireless Chains Behave? The Impact of MAC Interactions
In a Multi-hop Wireless Networks (MHWN), packets are routed between source
and destination using a chain of intermediate nodes; chains are a fundamental
communication structure in MHWNs whose behavior must be understood to enable
building effective protocols. The behavior of chains is determined by a number
of complex and interdependent processes that arise as the sources of different
chain hops compete to transmit their packets on the shared medium. In this
paper, we show that MAC level interactions play the primary role in determining
the behavior of chains. We evaluate the types of chains that occur based on the
MAC interactions between different links using realistic propagation and packet
forwarding models. We discover that the presence of destructive interactions,
due to different forms of hidden terminals, does not impact the throughput of
an isolated chain significantly. However, due to the increased number of
retransmissions required, the amount of bandwidth consumed is significantly
higher in chains exhibiting destructive interactions, substantially influencing
the overall network performance. These results are validated by testbed
experiments. We finally study how different types of chains interfere with each
other and discover that well behaved chains in terms of self-interference are
more resilient to interference from other chains
Finding the unfound: Recovery of missing URLs through Internet Archive
The study investigated the accessibility and permanency of citations containing URLs in the articles published in DESIDOC Journal of Library and Information Technology journal during 2006-2015. A total of 2133 URL citations were identified out of which 823 were found to be incorrect or missing. HTTP-404 was the most common error message associated with the missing URLs. The study also tried to recover the incorrect or URL citations using Internet Archive and recovered a total of 484 (58.81%) missing URL citations
Analyze and study the impacts of different packages on static and dynamic IR Drop analysis on different Infineon designs.
Dynamic voltage drop depends on the switching activity of the logic compared to static IR drop, and hence it is a vector dependent concept. In this paper we have highlighted the methodology of extraction and modeling of package along with the chip-package static IR drop as well as dynamic IR drop analysis scenarios.A proper structured approach to analyze the impact of package parasitics onto the die is presented, with an emphasis to cover different corners in which IR analysis is impacted, and how it can be implemented in the design cycle. Finally, the impact of package on chip is studied by considering the histogram plots obtained from dynamic IR numbers. Later using all the numbers & plots impact of different packages on chip is realized.Results are from acquired from industrial designs in 65nm process related to the said topics.
DOI: 10.17762/ijritcc2321-8169.15055
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