1 research outputs found
Sub-10 nm Tunable Hybrid Dielectric Engineering on MoS<sub>2</sub> for Two-Dimensional Material-Based Devices
The
successful realization of high-performance 2D-materials-based
nanoelectronics requires integration of high-quality dielectric films
as a gate insulator. In this work, we explore the integration of organic
and inorganic hybrid dielectrics on MoS<sub>2</sub> and study the
chemical and electrical properties of these hybrid films. Our atomic
force microscopy, X-ray photoelectron spectroscopy (XPS), Raman, and
photoluminescence results show that, aside from the excellent film
uniformity and thickness scalability down to 2.5 nm, the molecular
layer deposition of octenyltrichlorosilane (OTS) and Al<sub>2</sub>O<sub>3</sub> hybrid films preserves the chemical and structural
integrity of the MoS<sub>2</sub> surface. The XPS band alignment analysis
and electrical characterization reveal that through the inclusion
of an organic layer in the dielectric film, the band gap and dielectric
constant can be tuned from ∼7.00 to 6.09 eV and ∼9.0
to 4.5, respectively. Furthermore, the hybrid films show promising
dielectric properties, including a high breakdown field of ∼7.8
MV/cm, a low leakage current density of ∼1 × 10<sup>–6</sup> A/cm<sup>2</sup> at 1 MV/cm, a small hysteresis of ∼50 mV,
and a top-gate subthreshold voltage swing of ∼79 mV/dec. Our
experimental findings provide a facile way of fabricating scalable
hybrid gate dielectrics on transition metal dichalcogenides for 2D-material-based
flexible electronics applications