12 research outputs found

    Die elektrische Festigkeit von Polymeren als Extremgröße

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    Origin of thickness dependent dc electrical breakdown in dielectrics

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    A model based on space charge dynamics under high dc electric field has been proposed to explain commonly observed thickness dependent breakdown of polymeric material. The formation and dynamics of space charge will result in local electric field enhancement that has a direct impact on dielectric breakdown. The simulation results show that the breakdown depends on the sample thickness with a power index of 0.143, indicating the space charge and its dynamics are responsible for thickness dependent breakdown. The model also predicts the effect of voltage ramping rate on the electrical breakdown strength

    Flexible and Transparent Dielectric Film with a High Dielectric Constant Using Chemical Vapor Deposition-Grown Graphene Interlayer

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    We have devised a dielectric film with a chemical vapor deposited graphene interlayer and studied the effect of the graphene interlayer on the dielectric performance. The highly transparent and flexible film was a polymer/graphene/polymer 'sandwich-structure' fabricated by a one-step transfer method that had a dielectric constant of 51, with a dielectric loss of 0.05 at 1 kHz. The graphene interlayer in the film forms a space charge layer, i.e., an accumulation of polarized charge carriers near the graphene, resulting in an induced space charge polarization and enhanced dielectric constant. The characteristic of the space charge layer for the graphene dielectric film, the sheet resistance of the graphene interlayer, was adjusted through thermal annealing that caused partial oxidation. The dielectric film with higher sheet resistance due to the oxidized graphene interlayer had a significantly lower dielectric constant compared to that with the graphene with lower interlayer sheet resistance. Oxidizing the graphene interlayer yields a smaller and thinner space charge density in the dielectric film, ultimately leading to decreased capacitance. Considering the simplicity of the fabrication process and high dielectric performance, as well as the high transparency and flexibility, this film is promising for applications in plastic electronics
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