Study of the Effect of Low-Temperature Plasma Exposure on Mould Fungi Colonizing Paper

The influence of radiofrequency cold plasma in ambient air at 200 Pa pressure on mould fungi of the genus Aspergillus was studied. It was shown that 20 min plasma treatment of paper with mould and contamination reduced the number of colony forming units but didn't lead to complete suppression of fungal viability. Strains of A. versicolor after plasma treatment lost the ability to excrete pink pigment to the environment. A. niger strains were more resistant and kept acidification ability. One of the possible plasma inactivation factors was formation of reactive hydroxyl (OH) radical

ВОЗДЕЙСТВИЕ НИЗКОТЕМПЕРАТУРНОЙ ГАЗОРАЗРЯДНОЙ ПЛАЗМЫ НА ГРИБЫ РОДА ASPERGILLUS, КОЛОНИЗИРУЮЩИЕ БУМАГУ

It was found that the exposure to low-temperature gas discharge plasma at atmospheric pressure is an effective way of paper cleaning from fungal spores. This effect is explained by the specific mechanisms of micro-discharges excitation and maintaining that ensure efficient (up to 90 %) reduction in the number of viable mould spores without local heating biopolymeric materials.Изучено влияние низкотемпературной плазмы ВЧ, СВЧ и барьерного разрядов на жизнеспособность грибов-колонизаторов бумаги рода Aspergillus. Выявлена высокая эффективность плазмы барьерного разряда по сравнению с другими типами разрядов для деконтаминации материалов на биополимерной основе

THE EFFECT OF LOW-TEMPERATURE GAS DISCHARGE PLASMA ON FUNGI OF THE GENUS ASPERGILLUS COLONIZING PAPER

It was found that the exposure to low-temperature gas discharge plasma at atmospheric pressure is an effective way of paper cleaning from fungal spores. This effect is explained by the specific mechanisms of micro-discharges excitation and maintaining that ensure efficient (up to 90 %) reduction in the number of viable mould spores without local heating biopolymeric materials

The effect of low-temperature gas discharge plasma on fungi of the genus Aspergillus colonizing paper

Изучено влияние низкотемпературной плазмы ВЧ, СВЧ и барьерного разрядов на жизнеспособность грибов-колонизаторов бумаги рода Aspergillus. Выявлена высокая эффективность плазмы барьерного разряда по сравнению с другими типами разрядов для деконтаминации материалов на биополимерной основе. It was found that the exposure to low-temperature gas discharge plasma at atmospheric pressure is an effective way of paper cleaning from fungal spores. This effect is explained by the specific mechanisms of micro-discharges excitation and maintaining that ensure efficient (up to 90 %) reduction in the number of viable mould spores without local heating biopolymeric materials