Ultrathin Glass to Ultrathin Glass Bonding Using Laser Sealing Approach

International audienceThe advent of flexible thin-film electronic devices on ultrathin substrates is driven by the need to develop alternative handling methods fully compatible with front-end and back-end processes. The purpose of this work is to present a new handling approach for ultrathin glass substrates based on direct glass-glass bonding and peel-off debonding at room temperature. This concept is evaluated through the realization of thin-film batteries (500µm) without intermediate layer. The stack of thin film battery is fabricated using sequential physical vapor depositions at temperature values up to 400°C. The debond process is completed at room temperature by mechanical peel-off of the encapsulation film laminated on thin film battery. As the results, there is no sign of any crack of the ultrathin glass (<100µm) after debonding. Furthermore, the Electrochemical Impedance Spectroscopy (EIS) and galvanostatic cycling carried out before and after debonding process reveal that the device performances are slightly stable