Effect of Long-Term Storage on Microstructure and Microhardness Stability in OFHC Copper Processed by High-Pressure Torsion

Tests are conducted to evaluate the effect of long-term storage on the microstructure and microhardness of an oxygen-free high conductivity (OFHC) copper after processing by high-pressure torsion (HPT) for various numbers of revolutions at ambient temperature. Results are presented for samples subjected to storage at room temperature through periods of either 1.25 or 7 years. The results show that an increase in storage time leads to a coarsening of the ultrafine-grained structure produced by HPT processing and a corresponding decrease in the microhardess where this is associated with the occurrence of recrystallization and grain growth. Plots of hardness against equivalent strain reveal a three-stage behavior with much lower hardness values over a range of equivalent strains of ~2-8. This behavior is similar after both storage periods but the hardness values are lower and the grain sizes are larger after storage for the longer time. The results demonstrate that long-term storage has a significantly detrimental effect on the microstructure and hardness of ultrafine-grained OFHC Cu

Comparisons of self-annealing behaviour of HPT-processed high purity Cu and a Pb–Sn alloy.

Early published results have demonstrated that high purity Cu and a Pb–62% Sn alloy exhibit very different behaviour during high-pressure torsion (HPT) processing at room temperature and subsequent room temperature storage. High purity Cu showed strain hardening behaviour with a refined grain structure during HPT processing whereas a Pb–62% Sn alloy displayed a strain weakening behaviour because the hardness values after HPT processing were significantly lower than in the initial as-cast condition even though the grain size was reduced. During room temperature storage after HPT processing, high purity Cu with lower numbers of rotations softened with the time of storage due to local recrystallization and abnormal grain growth whereas the Pb–62% Sn alloy hardened with the time of storage accompanied by grain growth. Through comparisons and analysis, it is shown that the low absolute melting point and the high homologous temperature at room temperature in the Pb–62% Sn alloy contribute to the increase in hardness with coarsening grain size during room temperature storage