1 research outputs found
Surface State of Sacrificial Copper Electrode by Electropolishing in Hydrophobic Ionic Liquid 1‑Butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide
Anodic dissolution of natural surface-oxidized,
air-annealed, cathodically reduced, and cathodically deposited copper
in hydrophobic ionic liquid 1-buthyl-3-methylimidazolium bisÂ(trifluoromethylsulfonyl)Âimide
under galvanostatic conditions by means of gravimetric measurements
was studied. The resulting samples were mirror-like oxide-free copper
pattern. The mechanism of the electropolishing of oxidized copper
surface was considered. The consequent anodic reactions Cu<sub>2</sub>O – 1e = Cu<sup>+</sup> + CuO, CuO – 2e = Cu<sup>2+</sup> + O, and Cu – 1e = Cu<sup>+</sup> take place. The electropolishing
itself occurs over oxygen-free copper surface due to competitive residual
water discharge in the pits and copper dissolution on the roughness