25 research outputs found

    Temperature dependency of thermal conductivity of solid phases for fatty acids

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    Solid-Liquid Interfacial Energy of Solid Neopentylglycol Solution in Equilibrium with Neopentylglycol-Aminomethylpropanediol Eutectic Liquid

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    The grain boundary groove shapes for solid neopentylglycol solution (NPG-40 mol pct AMPD) in equilibrium with the neopentylglycol (NPG)-aminomethylpropanediol (AMPD) eutectic liquid (NPG-42.2 mol pct AMPD) have been directly observed using a horizontal linear temperature gradient apparatus. From the observed grain boundary groove shapes, the Gibbs-Thomson coefficient (D '') and solid-liquid interfacial energy (sigma (SL)) of solid NPG solution have been determined to be (7.4 +/- A 0.7) x 10(-8) K m and (6.4 +/- A 1.0) x 10(-3) J m(-2), respectively. The grain boundary energy of solid NPG solution has been determined to be (12.5 +/- A 1.0) x 10(-3) J m(-2) from the observed grain boundary groove shapes. The ratio of thermal conductivity of equilibrated eutectic liquid to thermal conductivity of solid NPG solution has also been determined to be 0.48. (C) The Minerals, Metals & Materials Society and ASM International 201

    The Experimental Determination of Interfacial Energies for Solid Cd in Equilibrium with Sn-Cd-Sb Liquid

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    The equilibrated grain boundary groove shapes of solid Cd in equilibrium with Sn-Cd-Sb liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy, and grain boundary energy of the solid Cd were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid phase for Sn-35.80 at. pct Cd-6.71 at. pct Sb alloy and the thermal conductivity ratio of the liquid phase to the solid phase for Sn-35.80 at. pct Cd-6.71 at. pct Sb alloy at eutectic temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively

    Experimental Determination of Interfacial Energy for Solid Zn Solution in the Sn-Zn Eutectic System

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    The grain boundary groove shapes for Zn solid solution in equilibrium with Sn-Zn eutectic liquid were observed with a radial heat flow apparatus. From the observed grain boundary groove shapes, the Gibbs-Thomson coefficient, the solid-liquid and the grain boundary energy for the Zn solid solution in equilibrium with Sn-Zn eutectic liquid were determined to be (2.32 +/- 0.13)x10(-8) Km, (120.87 +/- 13.29)x10(-3) J.m(-2) and (194.76 +/- 23.37)x10(-3) J.m(-2), respectively. The termal conductivity of the eutectic Sn- 9 wt% Zn solid solution, kappa(S), was obtained as 74.74 W/Km by using a radial heat flow apparatus. The thermal conductivity ratio of the eutectic liquid to the eutectic solid, R = kappa(L)/kappa(S) was found to be 0.58 with a Bridgman-type directional growth apparatus. Thus, the value of the thermal conductivity of eutectic Sn-9 wt% Zn liquid solution, kappa(L), was obtained as 43.82 W/Km

    Measurements of Thermal Conductivity Variations with Temperature for the Organic Analog of the Nonmetal–Nonmetal System: Urea–4-Bromo-2-Nitroaniline

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    Thermal conductivity variations with temperature for solid phases in the Urea (U)-[X] mol pct 4-bromo-2-nitroaniline (BNA) system (X = 0, 2, 45, 89.9, and 100) were measured using the radial heat flow method. From graphs of thermal conductivity variations with temperature, the thermal conductivities of the solid phases at their melting temperature and temperature coefficients for the U-[X] mol pct BNA system (X = 0, 2, 45, 89.9, and 100) were found to be 0.26, 0.55, 0.46, 0.38, and 0.23 W/Km and 0.007781, 0.005552, 0.002058, 0.002188, and 0.002811 K-1, respectively. The ratios of thermal conductivity of the liquid phase to thermal conductivity of the solid phase in the U-[X] mol pct BNA system (X = 0, 2, 45, 89.9, and 100) were also measured to be 0.30, 0.44, 0.46, 0.49, and 0.51, respectively, with a Bridgman-type directional solidification apparatus at their melting temperature. (C) The Minerals, Metals & Materials Society and ASM International 201
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