19 research outputs found

    Full-Duplex Systems Using Multi-Reconfigurable Antennas

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    Full-duplex systems are expected to achieve 100% rate improvement over half-duplex systems if the self-interference signal can be significantly mitigated. In this paper, we propose the first full-duplex system utilizing Multi-Reconfigurable Antenna (MRA) with ?90% rate improvement compared to half-duplex systems. MRA is a dynamically reconfigurable antenna structure, that is capable of changing its properties according to certain input configurations. A comprehensive experimental analysis is conducted to characterize the system performance in typical indoor environments. The experiments are performed using a fabricated MRA that has 4096 configurable radiation patterns. The achieved MRA-based passive self-interference suppression is investigated, with detailed analysis for the MRA training overhead. In addition, a heuristic-based approach is proposed to reduce the MRA training overhead. The results show that at 1% training overhead, a total of 95dB self-interference cancellation is achieved in typical indoor environments. The 95dB self-interference cancellation is experimentally shown to be sufficient for 90% full-duplex rate improvement compared to half-duplex systems.Comment: Submitted to IEEE Transactions on Wireless Communication

    Properties of High-Performance Concretes made of Black Sand at High Temperature

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    To modify high-performance concrete (HPC) fireproofing properties, black sand (BS) was partially substituted as fine aggregate at various levels. This study aims at evaluating the BS reliability in improving HPC durability properties for various construction applications based on its unique heavy minerals. To achieve this, five HPC series blends were setup to substitute fine aggregate independently with BS. Substitution percentages ranged from 15 to 100% with consistent supplementary cementing materials (SCMs) proportion for each gathering. Tests were performed to assess compressive strength before and after fire exposure under various temperatures of 250, 500 and 750 °C at different curing age. Generally, blending FA with BS was better than using SF with BS. Utilizing BS in the range of 15 to 60% as fine aggregate with 10% FA improves HPC fire-insulating properties. Besides, Z1 SEM analysis observed homogenously and compacted HPC microstructure at 250 and 500 °C. Doi: 10.28991/cej-2021-03091634 Full Text: PD

    Memristor Multiport Readout: A Closed-Form Solution for Sneak Paths

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    In this paper, we introduce for the first time, a closed-form solution for the memristor-based memory sneak paths without using any gating elements. The introduced technique fully eliminates the effect of sneak paths by reading the stored data using multiple access points and evaluating a simple addition/subtraction on the different readings. The new method requires fewer reading steps compared to previously reported techniques, and has a very small impact on the memory density. To verify the underlying theory, the proposed system is simulated using Synopsys HSPICE showing the ability to achieve a 100% sneak-path error-free memory. In addition, the effect of quantization bits on the system performance is studied. © 2014 IEEE

    A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

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    As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components that may be unreliable. In order to do so, it is crucial to understand the close interplay between the different layers of a system: technology, platform, and application. This will enable the most general tradeoff exploration, reaping the most benefits in power, performance and reliability. This paper surveys various cross layer techniques and approaches for power, performance, and reliability tradeoffs are technology, circuit, architecture and application layers. © 2013 Elsevier B.V. All rights reserved
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