Recurrent spontaneous third-trimester uterine rupture after hysteroscopic resection of myoma: a case report

Uterine rupture is a catastrophic obstetrical emergency with serious effects on both women and fetuses. Operative hysteroscopic procedures can add more risk factor for occurrence of this tragedy. Here, we report a case of spontaneous recurrent rupture uterus at 33 weeks of gestation in a 32 years old woman with previous history of hysteroscopic resection of submucous myoma after development of acute abdomen. Uterine repair of fundal rupture was performed through emergency exploratory laparotomy. Surgeons should explain to their patients the hazards of probable risk of recurrent and multiple uterine rupture in the future pregnancy and to document this discussion in the medical records before proceeding to operative hysteroscopic procedures

Deposition of Copper on Glass Substrate using Four Anode Rods Ion Source

ABSTRACT In this work, the four anode rods ion source has been tested at the optimum operation conditions for deposition of copper on glass substrate using argon ion beam. The electrical discharge and the output ion beam characteristics are determined without and with extraction voltage equal to -2 kV applied on both the extractor electrode and the ion collector plate. It is found that at a pressure equal to 2.8 x 10 -4 mmHg, discharge voltage equal to 2.75 kV, discharge current equal to 1.2 mA and without extraction voltage, the output ion beam current equal to 150 µA can be obtained. Using an extraction voltage equals -2.75 kV at the same conditions of pressure , discharge voltage and discharge current, the extracted ion beam current equal to 305 µA can be obtained. It can be concluded that at different argon gas pre ssures and extraction voltage equal to -2 kV, the value s of the extracted ion beam current from the ion source reach twice its initial value s without extraction voltage. The extracted argon ion beam from the ion source is used for sputtering of copper target surface atoms which deposit on glass substrate near from the target. The target surface after sputtering and the glass surface after copper atoms deposition are photographed using digital camera. The glass substrate after copper atoms deposition is photographed with magnification 48X using optical microscope with CCD (Charged Coupled Device) camera. The glass substrate is analyzed before and after copper atoms deposition using EDX (Energy Dispersive X -ray Spectrometer) spectrum. It is found that a peak of the deposited copper atoms on the glass surface appears at energy equals 8 keV