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1 research outputs found
Simulation of the effect of microstructure on the elastic properties of copper interconnects
Author
11th International Workshop on Stress-Induced Phenomena in Metallization – Stress Workshop 2010
Bull S.J.
+4Â more
Oila A.
Raskin Jean-Pierre
Sanderson L.
Wilson C.J.
Publication venue
Publication date
01/01/2010
Field of study
No full text
DIAL UCLouvain