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Simulation of the effect of microstructure on the elastic properties of copper interconnects
Authors
11th International Workshop on Stress-Induced Phenomena in Metallization – Stress Workshop 2010
S.J. Bull
+4 more
A. Oila
Jean-Pierre Raskin
L. Sanderson
C.J. Wilson
Publication date
1 January 2010
Publisher
Abstract
Abstract is not available.
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DIAL UCLouvain
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Last time updated on 14/05/2016
