(An) analysis of Organizational Citizenship Behaviors of front-line officers in Social service Providers : focusing on comparison between front-line officers in profit organizations and front-line officers in non-profit organizations

학위논문(석사) --서울대학교 행정대학원 :행정학과(행정학전공),2009.8.Maste

政策類型별 腐敗樣相에 관한 硏究

학위논문(석사)--서울대학교 행정대학원 :행정학과 행정학전공,1998.Maste

THROUGH SILICON VIA OPERATING AS FREQUENCY MIXER, 3-DIMENSIONAL INTEGRATED CIRCUIT INCLUDING THE SAME AND THE MANUFACTURING THEREOF

3차원 집적 회로를 구성하는 적어도 하나의 실리콘 기판을 관통하는 관통 실리콘 비아는 제1 면, 기둥 형상의 본체 및 제2 면을 포함한다. 상기 제1 면은 적어도 하나의 주파수를 가지는 적어도 하나의 전기적 입력 신호를 전달받는다. 상기 기둥 형상의 본체는 상기 전기적 입력 신호의 주파수의 합 또는 차에 상응하는 주파수를 가지는 전기적 신호를 포함하는 전기적 출력 신호를 생성한다. 상기 제2 면은 상기 제1 면과 대향하며, 상기 전기적 출력 신호를 외부에 전달한다

3차원 집적회로에서 실리콘 관통 비아의 잡음전달과 LC-VCO 성능 저하의 모델링 및 분석과 차폐에 대한 연구

학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 2014.2, [ vi, 47 p. ]As demands for the small form factor, wide bandwidth, high performance, and low power consump-tion have become greater in number, through silicon via (TSV) based 3-dimensional integrated circuit (3D IC) is expected to be the key to the solution of next generation technology. One of the most significant issues in 3D IC is noise coupling problem. As various function of ICs such as digital core, RF, and memory are combined with TSV for 3D IC, TSV noise can be easily coupled to near ICs. Especially, highly sensitive RF/analog components like LC-VCO can be strongly affected by TSV cou-pling noise through various paths. As a result, performance of RF circuit can be degraded. Many studies have focused on estimation of noise coupling coefficient. However the previous studies only consider TSV to TSV or TSV to contact coupling, and there is lack of research on TSV to active circuit noise coupling. In this thesis, noise coupling between TSV and LC-VCO which is targeted active circuit is analyzed. 5 paths of TSV to LC-VCO noise coupling are determined, and model of each path is proposed by 3D-TLM method. From the model, the voltage transfer function as the coupling coefficient is obtained. Then TSV noise coupling mechanism of each path is analyzed under several parameter variations The Model was veri-fied by 3D EM solver simulation. Noise coupling effect on LC VCO phase noise is investigated in each coupling path. Results of 5 noise coupling paths are compared, and the critical path is determined. After analysis of LC-VCO performance degradation due to TSV noise coupling, several shielding methods are proposed for noise suppression. Com-paring with each other, shielding methods are applied for improving performance of LC-VCO.한국과학기술원 : 전기및전자공학과