AWG-DBR-based WDM transmitter fabricated in an InP generic foundry platform

We report a novel narrow-linewidth WDM transmitter operating at 10 Gbps per transmission channel with 275 kHz optical linewidth. The device, which integrates an AWG-based laser using selective DBR-mirrors with a Mach-Zehnder modulator array, has been fabricated in a multi-project wafer run in a generic InP-based foundry process.</p

2023 Astrophotonics Roadmap: pathways to realizing multi-functional integrated astrophotonic instruments

This is the final version. Available on open access from IOP Publishing via the DOI in this recordData availability statement: The data that support the findings of this study are available upon reasonable request from the authors.Photonic technologies offer numerous functionalities that can be used to realize astrophotonic instruments. The most spectacular example to date is the ESO Gravity instrument at the Very Large Telescope in Chile that combines the light-gathering power of four 8 m telescopes through a complex photonic interferometer. Fully integrated astrophotonic devices stand to offer critical advantages for instrument development, including extreme miniaturization when operating at the diffraction-limit, as well as integration, superior thermal and mechanical stabilization owing to the small footprint, and high replicability offering significant cost savings. Numerous astrophotonic technologies have been developed to address shortcomings of conventional instruments to date, including for example the development of photonic lanterns to convert from multimode inputs to single mode outputs, complex aperiodic fiber Bragg gratings to filter OH emission from the atmosphere, complex beam combiners to enable long baseline interferometry with for example, ESO Gravity, and laser frequency combs for high precision spectral calibration of spectrometers. Despite these successes, the facility implementation of photonic solutions in astronomical instrumentation is currently limited because of (1) low throughputs from coupling to fibers, coupling fibers to chips, propagation and bend losses, device losses, etc, (2) difficulties with scaling to large channel count devices needed for large bandwidths and high resolutions, and (3) efficient integration of photonics with detectors, to name a few. In this roadmap, we identify 24 key areas that need further development. We outline the challenges and advances needed across those areas covering design tools, simulation capabilities, fabrication processes, the need for entirely new components, integration and hybridization and the characterization of devices. To realize these advances the astrophotonics community will have to work cooperatively with industrial partners who have more advanced manufacturing capabilities. With the advances described herein, multi-functional integrated instruments will be realized leading to novel observing capabilities for both ground and space based platforms, enabling new scientific studies and discoveries.National Science Foundation (NSF)NAS

AWG-DBR-based WDM transmitter fabricated in an InP generic foundry platform

We report a novel narrow-linewidth WDM transmitter operating at 10 Gbps per transmission channel with 275 kHz optical linewidth. The device, which integrates an AWG-based laser using selective DBR-mirrors with a Mach-Zehnder modulator array, has been fabricated in a multi-project wafer run in a generic InP-based foundry process

AWG-based multiwavelength lasers fabricated in a multi-project wafer run

We demonstrate one of the first monolithically integrated multiwavelength lasers fabricated in an industrial fab according to generic foundry model. Our devices were realized on an indium phosphide (InP)-based platform and use an arrayed waveguide grating (AWG) as intra-cavity filter. The designed sources generate wavelengths around 1.55 m with optical output power up to 5 dBm and side-mode suppression ratio (SMSR) better than 40 dB

Photonic integrated circuits : a new approach to laser technology Citation for published version (APA): Photonic integrated circuits -a new approach to laser technology

Abstract. In this work a brief review on photonic integrated circuits (PICs) is presented with a specific focus on integrated lasers and amplifiers. The work presents the history of development of the integration technology in photonics and its comparison to microelectronics. The major part of the review is focused on InP-based photonic integrated circuits, with a short description of the potential of the silicon technology. A completely new way of fabrication of PICs, called generic integration technology, is presented and discussed. The basic assumption of this approach is the very same as in the case of electronic circuits and states that a limited set of standard components, both active and passive, enables designing of a complex, multifunctional PIC of every type. As a result, functionally advanced, compact, energy efficient and cost-optimized photonic devices can be fabricated. The work presents also selected examples of active PICs like multiwavelength laser sources, discretely tunable lasers, WDM transmitters, ring lasers etc

InP photonic circuits using generic integration

InP integrated photonics has become a critical enabler for modern telecommunications, and is poised to revolutionize data communications, precision metrology, spectrometry, and imaging. The possibility to integrate high-performance amplifiers, lasers, modulators, and detectors in combination with interferometers within one chip is enabling game-changing performance advances, energy savings, and cost reductions. Generic integration accelerates progress through the separation of applications from a common technology development. In this paper, we review the current status in InP integrated photonics and the efforts to integrate the next generation of high-performance functionality on a common substrate using the generic methodology. © 2015 Chinese Laser Press OCIS codes: (250.0250) Optoelectronics; (250.5300) Photonic integrated circuits. http://d