Models predicting the performance of IC component or PCB channel during electromagnetic interference

This dissertation is composed of three papers, which cover the prediction of the characteristics of jitter due to crosstalk and due to simultaneous switching noise, and covers susceptibility of delay locked loop (DLL) to electromagnetic interference. In the first paper, an improved tail-fit de-convolution method is proposed for characterizing the impact of deterministic jitter in the presence of random jitter. A Wiener filter de-convolution method is also presented for extracting the characteristics of crosstalk induced jitter from measurements of total jitter made when the crosstalk sources were and were not present. The proposed techniques are shown to work well both in simulations and in measurements of a high-speed link. In the second paper, methods are developed to predict the statistical distribution of timing jitter due to dynamic currents drawn by an integrated circuit (IC) and the resulting power supply noise on the PCB. Distribution of dynamic currents is found through vectorless methods. Results demonstrate the approach can rapidly determine the average and standard deviation of the power supply noise voltage and the peak jitter within 5~15% error, which is more than sufficient for predicting the performance impact on integrated circuits. In the third paper, a model is developed to predict the susceptibility of a DLL to electromagnetic noise on the power supply. With the proposed analytical noise transfer function, peak to peak jitter and cycle to cycle jitter at the DLL output can be estimated, which can be use to predict when soft failures will occur and to better understand how to fix these failures. Simulation and measurement results demonstrate the accuracy of the DLL delay model. --Abstract, page iv

Statistical static timing analysis considering the impact of power supply noise in VLSI circuits

As semiconductor technology is scaled and voltage level is reduced, the impact of the variation in power supply has become very significant in predicting the realistic worst-case delays in integrated circuits. The analysis of power supply noise is inevitable because high correlations exist between supply voltage and delay. Supply noise analysis has often used a vector-based timing analysis approach. Finding a set of test vectors in vector-based approaches, however, is very expensive, particularly during the design phase, and becomes intractable for larger circuits in DSM technology. In this work, two novel vectorless approaches are described such that increases in circuit delay, because of power supply noise, can be efficiently, quickly estimated. Experimental results on ISCAS89 circuits reveal the accuracy and efficiency of my approaches: in s38417 benchmark circuits, errors on circuit delay distributions are less than 2%, and both of my approaches are 67 times faster than the traditional vector-based approach. Also, the results show the importance of considering care-bits, which sensitize the longest paths during the power supply noise analysis

Transition-Aware Decoupling-Capacitor Allocation in Power Noise Reduction

Abstract-Dynamic power noises may not only degrade the circuit performance but also reduce the noise margin which may result in the functional errors in integrated circuit. Decoupling capacitor (decap) allocation is one of the most effective way in reducing serious dynamic power noises (hotspots). To allocate decap bef ore placement, we observed that not only locations but also rising time of functional cells are required to accurately predict power noises. Compared to a previous work which only takes neighborhood relation into consideration, our method is more efficient in reducing hotspots. Furthermore, to reduce the hotspots af ter placement, instead of only using the empty space as proposed in the previous work, we move out cells in the area with serious power noise area (hot area). The obtained empty space can be used to accommodate decaps to further reduce the hotspots. The experimental result shows, compared to the previous work [1], our estimation function to allocate decap before placement is 23% better in reducing power noises. Moreover, compared to a method which fills decaps to all remaining empty space, our cell move algorithm can almost eliminate all the remaining hot grid nodes and hot cells. In summary, compared to the original circuits (without decap), about 60% of hotspots can be removed using our prediction function before placement, and most of the remaining hotspots are removed by our cell moving step after placement

Understanding of On-Chip Power Supply Noise: Suppression Methodologies and Challenges

The on-chip activities of any modern IC are always inhibited due to the occurrence of power supply noise (PSN) in the chip power line. From many decades, researchers are pondering on what are the major issue of this PSN occurrence and how it can be suppressed without interfering the actual chip functioning. In the course of time, it is found that the uncontrolled triggering of the on-chip system clock and the unguarded on-chip power line is instigating the two major factors for the occurrence of PSN i.e., i(t) → instantaneous current and di/dt → current ramp or the rate of change of current over time. Both i(t) and di/dt are also the sub-factors to rise the PSN components like resistive noise and inductive noise respectively. In this chapter, we light upon the occurrence of resistive and inductive noise as well as depict their individual impact on the PSN occurrences. There is also discussion on how PSN is suppressed over the years in spite of facing challenges in the execution of suppression techniques. This chapter even concludes on the suitable ways for mitigating PSN in the contemporary era of delivering complex on-chip features

Design and Analysis of Power Distribution Networks in VLSI Circuits.

Rapidly switching currents of the on-chip devices can cause fluctuations in the supply voltage which can be classified as IR and Ldi/dt drops. The voltage fluctuations in a supply network can inject noise in a circuit which may lead to functional failures of the design. Power supply integrity verification is, therefore, a critical concern in high-performance designs. Also, with decreasing supply voltages, gate-delay is becoming increasingly sensitive to supply voltage variation. With ever-diminishing clock periods, accurate analysis of the impact of supply voltage on circuit performance has also become critical. Increasing power consumption and clock frequency have exacerbated the Ldi/dt drop in every new technology generation. The Ldi/dt drop has become the dominant portion of the overall supply-drop in high performance designs. On-die passive decap, which has traditionally been used for suppressing Ldi/dt, has become expensive due to its area and leakage power overhead. This has created an urgent need for novel circuit techniques to suppress the Ldi/dt drop in power distribution networks. We provide accurate algorithmic solutions for determining the worst-case supply-drop and the impact of supply noise on circuit performance. We propose a path-based and a block-based approach for computing the maximum circuit delay under power supply fluctuations. We also propose an early-mode supply-drop estimation approach and a statistical approach for power grid analysis. All the proposed approaches are vectorless and account for both IR and Ldi/dt drops. We also propose a performance-aware decoupling capacitance allocation technique which uses timing slacks to drive the optimization. Finally, we present analog as well as all-digital circuit techniques for inductive supply noise suppression. The proposed all-digital circuit techniques were implemented in a test-chip, fabricated in a 0.13µm CMOS process. Measurements on the test-chip demonstrate a reduction in the supply fluctuations by 57% for a ramp loads and by 75% during resonance. We also present a low-power, all-digital on-chip oscilloscope for accurate measurement of supply noise. Supply noise measurements obtained from the on-chip oscilloscope were validated to conform well to those obtained from a traditional supply-drop monitor and direct on-chip probing.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/58508/1/spant_1.pd

Empirical timing analysis of CPUs and delay fault tolerant design using partial redundancy

The operating clock frequency is determined by the longest signal propagation delay, setup/hold time, and timing margin. These are becoming less predictable with the increasing design complexity and process miniaturization. The difficult challenge is then to ensure that a device operating at its clock frequency is error-free with quantifiable assurance. Effort at device-level engineering will not suffice for these circuits exhibiting wide process variation and heightened sensitivities to operating condition stress. Logic-level redress of this issue is a necessity and we propose a design-level remedy for this timing-uncertainty problem. The aim of the design and analysis approaches presented in this dissertation is to provide framework, SABRE, wherein an increased operating clock frequency can be achieved. The approach is a combination of analytical modeling, experimental analy- sis, hardware /time-redundancy design, exception handling and recovery techniques. Our proposed design replicates only a necessary part of the original circuit to avoid high hardware overhead as in triple-modular-redundancy (TMR). The timing-critical combinational circuit is path-wise partitioned into two sections. The combinational circuits associated with long paths are laid out without any intrusion except for the fan-out connections from the first section of the circuit to a replicated second section of the combinational circuit. Thus only the second section of the circuit is replicated. The signals fanning out from the first section are latches, and thus are far shorter than the paths spanning the entire combinational circuit. The replicated circuit is timed at a subsequent clock cycle to ascertain relaxed timing paths. This insures that the likelihood of mistiming due to stress or process variation is eliminated. During the subsequent clock cycle, the outcome of the two logically identical, yet time-interleaved, circuit outputs are compared to detect faults. When a fault is detected, the retry sig- nal is triggered and the dynamic frequency-step-down takes place before a pipe flush, and retry is issued. The significant timing overhead associated with the retry is offset by the rarity of the timing violation events. Simulation results on ISCAS Benchmark circuits show that 10% of clock frequency gain is possible with 10 to 20 % of hardware overhead of replicated timing-critical circuit

Parametric Yield of VLSI Systems under Variability: Analysis and Design Solutions

Variability has become one of the vital challenges that the designers of integrated circuits encounter. variability becomes increasingly important. Imperfect manufacturing process manifest itself as variations in the design parameters. These variations and those in the operating environment of VLSI circuits result in unexpected changes in the timing, power, and reliability of the circuits. With scaling transistor dimensions, process and environmental variations become significantly important in the modern VLSI design. A smaller feature size means that the physical characteristics of a device are more prone to these unaccounted-for changes. To achieve a robust design, the random and systematic fluctuations in the manufacturing process and the variations in the environmental parameters should be analyzed and the impact on the parametric yield should be addressed. This thesis studies the challenges and comprises solutions for designing robust VLSI systems in the presence of variations. Initially, to get some insight into the system design under variability, the parametric yield is examined for a small circuit. Understanding the impact of variations on the yield at the circuit level is vital to accurately estimate and optimize the yield at the system granularity. Motivated by the observations and results, found at the circuit level, statistical analyses are performed, and solutions are proposed, at the system level of abstraction, to reduce the impact of the variations and increase the parametric yield. At the circuit level, the impact of the supply and threshold voltage variations on the parametric yield is discussed. Here, a design centering methodology is proposed to maximize the parametric yield and optimize the power-performance trade-off under variations. In addition, the scaling trend in the yield loss is studied. Also, some considerations for design centering in the current and future CMOS technologies are explored. The investigation, at the circuit level, suggests that the operating temperature significantly affects the parametric yield. In addition, the yield is very sensitive to the magnitude of the variations in supply and threshold voltage. Therefore, the spatial variations in process and environmental variations make it necessary to analyze the yield at a higher granularity. Here, temperature and voltage variations are mapped across the chip to accurately estimate the yield loss at the system level. At the system level, initially the impact of process-induced temperature variations on the power grid design is analyzed. Also, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. Then, a statistical analysis of the timing yield is conducted, by taking into account both the process and environmental variations. By considering the statistical profile of the temperature and supply voltage, the process variations are mapped to the delay variations across a die. This ensures an accurate estimation of the timing yield. In addition, a method is proposed to accurately estimate the power yield considering process-induced temperature and supply voltage variations. This helps check the robustness of the circuits early in the design process. Lastly, design solutions are presented to reduce the power consumption and increase the timing yield under the variations. In the first solution, a guideline for floorplaning optimization in the presence of temperature variations is offered. Non-uniformity in the thermal profiles of integrated circuits is an issue that impacts the parametric yield and threatens chip reliability. Therefore, the correlation between the total power consumption and the temperature variations across a chip is examined. As a result, floorplanning guidelines are proposed that uses the correlation to efficiently optimize the chip's total power and takes into account the thermal uniformity. The second design solution provides an optimization methodology for assigning the power supply pads across the chip for maximizing the timing yield. A mixed-integer nonlinear programming (MINLP) optimization problem, subject to voltage drop and current constraint, is efficiently solved to find the optimum number and location of the pads