A Novel variation-tolerant 9T SRAM design for nanoscale CMOS

As the feature sizes decrease, understanding manufacturing variations becomes essential to effectively design robust circuits. Manufacturing variations occur when process parameters deviate from their ideal or expected values, resulting in variations in device characteristics. Variations in the device characteristics cause the circuit to deviate from its expected behavior resulting in circuit instability, performance degradation, and yield loss. Both from an economic and performance standpoint, the yield and performance of Static Random Access Memories (SRAMs) are of great importance to the modern System-on-Chip designs. SRAM bitcells typically employ well-matched, minimum-sized transistors which make them highly sensitive to process variations. To overcome these challenges, researchers have proposed different topologies for SRAMs with 8T and 10T SRAM designs. These designs improve the cell stability but suffer from bitline-leakage noise, placing constraints on the number of cells shared by each bitline. These designs also have substantial area overhead when compared to the traditional 6T design. In this work, the published SRAM designs are characterized using commercial CMOS 65 nm models and are compared based on critical SRAM parameters like read stability, write stability, bitline leakage and the impact of process variations. Furthermore, a single-ended 9T SRAM design is proposed that enhances data stability and simultaneously addresses the bitline leakage problem. The proposed design also satisfies the yield criterion to achieve 90% yield for a 1Mb SRAM array in the presence of process variations

Reconfigurable negative bit line collapsed supply write-assist for 9T-ST static random access memory cell

This paper presents a reconfigurable negative bit line collapsed supply (RNBLCS) write driver circuit for the 9T Schmitt trigger-based static random-access memory (SRAM) cell (9T-ST), significantly improving write performance for real-time memory applications. In deep sub-micron technology, increasing device parameter deviations significantly reduce SRAM cells' write-ability. The proposed RNBLCS write-assist driver for 9T-ST SRAM cell has 0.84×, 0.48×, 0.27× optimized write access delay and 1.05×, 1.08×, 1.19× improvement in write static noise margin (WSNM), 1.05×, 1.13×, and 1.39× improvement in write margin (WM), 0.96×, 0.89× and 0.72× minimum write trip-point (WTP) from transient-negative bit line (Tran-NBL), capacitive charge sharing (CCS), and conventional write circuits respectively. The proposed RNBLCS is functionally verified using a synopsys custom compiler with a 16 nm BSIM4 model card for bulk complementary metal-oxide semiconductor (CMOS)

Design of High-Speed Dual Port 8T SRAM Cell with Simultaneous and Parallel READ-WRITE Feature

An innovative 8 transistor (8T) static random access memory (SRAM) architecture with a simple and reliable read operation is presented in this study. LTspice software is used to implement the suggested topology in the 16nm predictive technology model (PTM). Investigations into and comparisons with conventional 6T, 8T, 9T, and 10T SRAM cells have been made regarding read and write operations\u27 delay and power consumption as well as power delay product (PDP). The simulation outcomes show that the suggested design offers the fastest read operation and PDP optimization overall. Compared to the current 6T and 9T topologies, the noise margin is also enhanced. Finally, the comparison of the figure of merit (FoM) indicates the best efficiency of the proposed design

Design and modelling of different SRAM's based on CNTFET 32nm technology

Carbon nanotube field-effect transistor (CNTFET) refers to a field-effect transistor that utilizes a single carbon nanotube or an array of carbon nanotubes as the channel material instead of bulk silicon in the traditional MOSFET structure. Since it was first demonstrated in 1998, there have been tremendous developments in CNTFETs, which promise for an alternative material to replace silicon in future electronics. Carbon nanotubes are promising materials for the nano-scale electron devices such as nanotube FETs for ultra-high density integrated circuits and quantum-effect devices for novel intelligent circuits, which are expected to bring a breakthrough in the present silicon technology. A Static Random Access Memory (SRAM) is designed to plug two needs: i) The SRAM provides as cache memory, communicating between central processing unit and Dynamic Random Access Memory (DRAM). ii) The SRAM technology act as driving force for low power application since SRAM is portable compared to DRAM, and SRAM doesn't require any refresh current. On the basis of acquired knowledge, we present different SRAM's designed for the conventional CNTFET. HSPICE simulations of this circuit using Stanford CNTFET model shows a great improvement in power saving.Comment: 15 Page

Enhancing SRAM Cell Circuitry through PDLPDC Optimization

This study focuses on improving static random-access memory (SRAM) cell circuit design by leveraging the Power Dissipation Low Power Dissipation Circuit (PDLPDC). The PDLPDC, a low-power dissipation circuit, has gained widespread use in designing cells for read operations, write operations, and idle modes, contributing to power optimisation in submicron or nano-range Very Large Scale Integration (VLSI) designs. While various SRAM cells, including 6T and 10T configurations, have been developed, they often exhibit higher power consumption. In contrast, our PDLPDC-based approach operates at lower power levels. With the increasing integration of portable devices into everyday life, power optimisation has emerged as a critical challenge in modern VLSI technology. Many contemporary gadgets and systems rely on very Large-scale Integration (VLSI) technology, where static random-access memory (SRAM) blocks occupy substantial chip space and represent a significant source of leakage power in current systems. However, a common practice, scaling the supply voltage of SRAM macros can lead to elevated power dissipation. This research addresses the challenge by efficiently scaling the supply voltage of SRAM macros, resulting in an overall reduction in power dissipation. The study introduces 6T and 10T SRAM circuits that minimise power dissipation during read and write operations while maintaining reasonable performance and stability. The impact of process parameter variations on various design metrics, including read and write power, leakage power, leakage current, and latency, becomes a critical consideration in SRAM cell design with increased integration scale. The proposed circuit, optimised for the minimum power-delay product during read, write, and idle modes, is compared with traditional SRAM cells (6T and 10T) and demonstrates superior performance, reliability, and power efficiency. This research contributes to advancing the understanding of SRAM circuit design, especially in the context of power optimisation and process variations

Four-injector variability modeling of FinFET predictive technology models

The usual way of modeling variability using threshold voltage shift and drain current amplification is becoming inaccurate as new sources of variability appear in sub-22nm devices. In this work we apply the four-injector approach for variability modeling to the simulation of SRAMs with predictive technology models from 20nm down to 7nm nodes. We show that the SRAMs, designed following ITRS roadmap, present stability metrics higher by at least 20% compared to a classical variability modeling approach. Speed estimation is also pessimistic, whereas leakage is underestimated if sub-threshold slope and DIBL mismatch and their correlations with threshold voltage are not considered

Low Leakage and Robust Sub-threshold SRAM Cell using Memristor

This work aims to improve the total power dissipation, leakage currents and stability without disturbing the logic state of SRAM cell with concept called sub-threshold operation. Though, sub-threshold SRAM proves to be advantageous but fails with basic 6T SRAM cell during readability and writability. In this paper we have investigated a non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell working at lower supply voltage of VDD=0.3V, where Memristor is used to store the information even at power failures and restores previous data with successful read and write operation overcomes the challenge faced. This paper also proposes a new configuration of non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell resulting in improved behaviour in terms of power, stability and leakage current where read and write power has improved by 40% and 90% respectively when compared to 6T2M (conventional) SRAM cell. The proposed 6T2M SRAM cell offers good stability of RSNM=65mV and WSNM=93mV which is much improved at low voltage when compared to conventional basic 6T SRAM cell, and improved leakage current of 4.92nA is achieved as compared

Low Leakage and Robust Sub-threshold SRAM Cell using Memristor

This work aims to improve the total power dissipation, leakage currents and stability without disturbing the logic state of SRAM cell with concept called sub-threshold operation. Though, sub-threshold SRAM proves to be advantageous but fails with basic 6T SRAM cell during readability and writability. In this paper we have investigated a non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell working at lower supply voltage of VDD=0.3V, where Memristor is used to store the information even at power failures and restores previous data with successful read and write operation overcomes the challenge faced. This paper also proposes a new configuration of non-volatile 6T2M (6 Transistors & 2 Memristors) sub-threshold SRAM cell resulting in improved behaviour in terms of power, stability and leakage current where read and write power has improved by 40% and 90% respectively when compared to 6T2M (conventional) SRAM cell. The proposed 6T2M SRAM cell offers good stability of RSNM=65mV and WSNM=93mV which is much improved at low voltage when compared to conventional basic 6T SRAM cell, and improved leakage current of 4.92nA is achieved as compared