Towards Reliability and Performance-Aware Wireless Network-on-Chip Design

Recently, an improved surface wave-enabled communication fabric has been proposed to solve the reliability issues of emerging hybrid wired-wireless Network-on-Chip (WiNoC) architectures. Thus, providing a promising solution to the performance and scalability demands of the fast-paced technological growth towards exascale and Big-Data processing on future System-on-Chip (SoC) design. However, WiNoCs tradeoff optimized performance for cost by restricting the number of area and power hungry wireless nodes. Consequently, in this paper, we propose a low-latency adaptive router with a low-complexity single-cycle bypassing mechanism to alleviate the performance degradation due to the slow wired routers in such emerging hyhbrid NoCs. The proposed router is able to redistribute traffic in the network to alleviate average packet latency at both low and high traffic conditions. As a second contribution the paper presents an experimental evaluation of a practically implemented surface wave communication fabric. By reducing the latency between the wired nodes and wireless nodes the proposed router can improve performance efficiency in terms of average packet delay by an average of 50% in WiNoC

Portability, compatibility and reuse of MAC protocols across different IoT radio platforms

To cope with the diversity of Internet of Things (loT) requirements, a large number of Medium Access Control (MAC) protocols have been proposed in scientific literature, many of which are designed for specific application domains. However, for most of these MAC protocols, no multi-platform software implementation is available. In fact, the path from conceptual MAC protocol proposed in theoretical papers, towards an actual working implementation is rife with pitfalls. (i) A first problem is the timing bugs, frequently encountered in MAC implementations. (ii) Furthermore, once implemented, many MAC protocols are strongly optimized for specific hardware, thereby limiting the potential of software reuse or modifications. (iii) Finally, in real-life conditions, the performance of the MAC protocol varies strongly depending on the actual underlying radio chip. As a result, the same MAC protocol implementation acts differently per platform, resulting in unpredictable/asymmetrical behavior when multiple platforms are combined in the same network. This paper describes in detail the challenges related to multi-platform MAC development, and experimentally quantifies how the above issues impact the MAC protocol performance when running MAC protocols on multiple radio chips. Finally, an overall methodology is proposed to avoid the previously mentioned cross-platform compatibility issues. (C) 2018 Elsevier B.V. All rights reserved

Reliable data delivery in low energy ad hoc sensor networks

Reliable delivery of data is a classical design goal for reliability-oriented collection routing protocols for ad hoc wireless sensor networks (WSNs). Guaranteed packet delivery performance can be ensured by careful selection of error free links, quick recovery from packet losses, and avoidance of overloaded relay sensor nodes. Due to limited resources of individual senor nodes, there is usually a trade-off between energy spending for packets transmissions and the appropriate level of reliability. Since link failures and packet losses are unavoidable, sensor networks may tolerate a certain level of reliability without significantly affecting packets delivery performance and data aggregation accuracy in favor of efficient energy consumption. However a certain degree of reliability is needed, especially when hop count increases between source sensor nodes and the base station as a single lost packet may result in loss of a large amount of aggregated data along longer hops. An effective solution is to jointly make a trade-off between energy, reliability, cost, and agility while improving packet delivery, maintaining low packet error ratio, minimizing unnecessary packets transmissions, and adaptively reducing control traffic in favor of high success reception ratios of representative data packets. Based on this approach, the proposed routing protocol can achieve moderate energy consumption and high packet delivery ratio even with high link failure rates. The proposed routing protocol was experimentally investigated on a testbed of Crossbow's TelosB motes and proven to be more robust and energy efficient than the current implementation of TinyOS2.x MultihopLQI

Evaluation of temperature-performance trade-offs in wireless network-on-chip architectures

Continued scaling of device geometries according to Moore\u27s Law is enabling complete end-user systems on a single chip. Massive multicore processors are enablers for many information and communication technology (ICT) innovations spanning various domains, including healthcare, defense, and entertainment. In the design of high-performance massive multicore chips, power and heat are dominant constraints. Temperature hotspots witnessed in multicore systems exacerbate the problem of reliability in deep submicron technologies. Hence, there is a great need to explore holistic power and thermal optimization and management strategies for the massive multicore chips. High power consumption not only raises chip temperature and cooling cost, but also decreases chip reliability and performance. Thus, addressing thermal concerns at different stages of the design and operation is critical to the success of future generation systems. The performance of a multicore chip is also influenced by its overall communication infrastructure, which is predominantly a Network-on-Chip (NoC). The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency, significant power consumption, and temperature hotspots arising out of long, multi-hop wireline links used in data exchange. On-chip wireless networks are envisioned as an enabling technology to design low power and high bandwidth massive multicore architectures. However, optimizing wireless NoCs for best performance does not necessarily guarantee a thermally optimal interconnection architecture. The wireless links being highly efficient attract very high traffic densities which in turn results in temperature hotspots. Therefore, while the wireless links result in better performance and energy-efficiency, they can also cause temperature hotspots and undermine the reliability of the system. Consequently, the location and utilization of the wireless links is an important factor in thermal optimization of high performance wireless Networks-on-Chip. Architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance yet energy-efficient massive multicore chips. This work contributes to exploration of various the design methodologies for establishing wireless NoC architectures that achieve the best trade-offs between temperature, performance and energy-efficiency. It further demonstrates that incorporating Dynamic Thermal Management (DTM) on a multicore chip designed with such temperature and performance optimized Wireless Network-on-Chip architectures improves thermal profile while simultaneously providing lower latency and reduced network energy dissipation compared to its conventional counterparts