Experiment Investigation and Optimization for Slider Bonding Process to Enhance the Shear Strength of Epoxy Adhesive Joint

The shear strength of adhesive bonding between the slider and suspension greatly affects the quality of the hard disk drive. Therefore, this paper intends to determine the optimal slider bonding parameters which can maximize the shear strength of the adhesive joint. The response surface methodology (RSM) and optimization are employed to investigate the effects of five process parameters to the shear strength of the adhesive joint. Next, the central composite design which is a RSM is conducted. The analysis of variance is used to identify the significant terms of the quadratic regression model. Then, the optimization approach is utilized to determine the optimal process parameters with the mean shear strength of 257.62 gf. The confirmation experiment to validate the quadratic model reveals that the prediction error is only 1.6% which is acceptable. Next, the regression model is also used to define the optimal process conditions under the capacity constraint. In this case, the regression model can provide the accurate prediction of the shear strength with 1.14% error. In conclusion, the RSM and optimization approach can effectively yield the optimal process parameters that can enhance the shear strength of the adhesive joint to achieve the appropriate quality level

Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect

Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias (TSVs) and inter-chip interconnects. Anisotropic Conductive Film (ACF) technology is one of the low-temperature, fine-pitch interconnect method, which has been considered as a potential replacement for solder interconnects in line with continuous scaling of the interconnects in the IC industry. However, the conventional ACF materials are facing challenges to accommodate the reduced pad and pitch size due to the micro-size particles and the particle agglomeration issue. A new interconnect material - Nanowire Anisotropic Conductive Film (NW-ACF), composed of high density copper nanowires of ~ 200 nm diameter and 10-30 µm length that are vertically distributed in a polymeric template, is developed in this work to tackle the constrains of the conventional ACFs and serves as an inter-chip interconnect solution for potential three-dimensional (3D) applications