4,848 research outputs found

    Ozone: Efficient Execution with Zero Timing Leakage for Modern Microarchitectures

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    Time variation during program execution can leak sensitive information. Time variations due to program control flow and hardware resource contention have been used to steal encryption keys in cipher implementations such as AES and RSA. A number of approaches to mitigate timing-based side-channel attacks have been proposed including cache partitioning, control-flow obfuscation and injecting timing noise into the outputs of code. While these techniques make timing-based side-channel attacks more difficult, they do not eliminate the risks. Prior techniques are either too specific or too expensive, and all leave remnants of the original timing side channel for later attackers to attempt to exploit. In this work, we show that the state-of-the-art techniques in timing side-channel protection, which limit timing leakage but do not eliminate it, still have significant vulnerabilities to timing-based side-channel attacks. To provide a means for total protection from timing-based side-channel attacks, we develop Ozone, the first zero timing leakage execution resource for a modern microarchitecture. Code in Ozone execute under a special hardware thread that gains exclusive access to a single core's resources for a fixed (and limited) number of cycles during which it cannot be interrupted. Memory access under Ozone thread execution is limited to a fixed size uncached scratchpad memory, and all Ozone threads begin execution with a known fixed microarchitectural state. We evaluate Ozone using a number of security sensitive kernels that have previously been targets of timing side-channel attacks, and show that Ozone eliminates timing leakage with minimal performance overhead

    Cross-layer system reliability assessment framework for hardware faults

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    System reliability estimation during early design phases facilitates informed decisions for the integration of effective protection mechanisms against different classes of hardware faults. When not all system abstraction layers (technology, circuit, microarchitecture, software) are factored in such an estimation model, the delivered reliability reports must be excessively pessimistic and thus lead to unacceptably expensive, over-designed systems. We propose a scalable, cross-layer methodology and supporting suite of tools for accurate but fast estimations of computing systems reliability. The backbone of the methodology is a component-based Bayesian model, which effectively calculates system reliability based on the masking probabilities of individual hardware and software components considering their complex interactions. Our detailed experimental evaluation for different technologies, microarchitectures, and benchmarks demonstrates that the proposed model delivers very accurate reliability estimations (FIT rates) compared to statistically significant but slow fault injection campaigns at the microarchitecture level.Peer ReviewedPostprint (author's final draft

    Evaluating Cache Coherent Shared Virtual Memory for Heterogeneous Multicore Chips

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    The trend in industry is towards heterogeneous multicore processors (HMCs), including chips with CPUs and massively-threaded throughput-oriented processors (MTTOPs) such as GPUs. Although current homogeneous chips tightly couple the cores with cache-coherent shared virtual memory (CCSVM), this is not the communication paradigm used by any current HMC. In this paper, we present a CCSVM design for a CPU/MTTOP chip, as well as an extension of the pthreads programming model, called xthreads, for programming this HMC. Our goal is to evaluate the potential performance benefits of tightly coupling heterogeneous cores with CCSVM

    Using MCD-DVS for dynamic thermal management performance improvement

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    With chip temperature being a major hurdle in microprocessor design, techniques to recover the performance loss due to thermal emergency mechanisms are crucial in order to sustain performance growth. Many techniques for power reduction in the past and some on thermal management more recently have contributed to alleviate this problem. Probably the most important thermal control technique is dynamic voltage and frequency scaling (DVS) which allows for almost cubic reduction in power with worst-case performance penalty only linear. So far, DVS techniques for temperature control have been studied at the chip level. Finer grain DVS is feasible if a globally-asynchronous locally-synchronous (GALS) design style is employed. GALS, also known as multiple-clock domain (MCD), allows for an independent voltage and frequency control for each one of the clock domains that are part of the chip. There are several studies on DVS for GALS that aim to improve energy and power efficiency but not temperature. This paper proposes and analyses the usage of DVS at the domain level to control temperature in a clustered MCD microarchitecture with the goal of improving the performance of applications that do not meet the thermal constraints imposed by the designers.Peer ReviewedPostprint (published version

    Recent advances in 3D printing of biomaterials.

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    3D Printing promises to produce complex biomedical devices according to computer design using patient-specific anatomical data. Since its initial use as pre-surgical visualization models and tooling molds, 3D Printing has slowly evolved to create one-of-a-kind devices, implants, scaffolds for tissue engineering, diagnostic platforms, and drug delivery systems. Fueled by the recent explosion in public interest and access to affordable printers, there is renewed interest to combine stem cells with custom 3D scaffolds for personalized regenerative medicine. Before 3D Printing can be used routinely for the regeneration of complex tissues (e.g. bone, cartilage, muscles, vessels, nerves in the craniomaxillofacial complex), and complex organs with intricate 3D microarchitecture (e.g. liver, lymphoid organs), several technological limitations must be addressed. In this review, the major materials and technology advances within the last five years for each of the common 3D Printing technologies (Three Dimensional Printing, Fused Deposition Modeling, Selective Laser Sintering, Stereolithography, and 3D Plotting/Direct-Write/Bioprinting) are described. Examples are highlighted to illustrate progress of each technology in tissue engineering, and key limitations are identified to motivate future research and advance this fascinating field of advanced manufacturing
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